FEMC256GBE-T740

The FEMC256GBE-T740 from Flexxon is a high-capacity 256GB embedded MultiMediaCard (eMMC) 5.1 memory solution built with advanced 3D TLC NAND flash technology. Part of the XTRA VII Series, this industrial-grade non-volatile memory module delivers robust data storage performance in a compact 153-ball FBGA package, operating reliably across an extended temperature range of -25°C to 85°C.

Designed for embedded systems requiring substantial storage capacity with proven reliability, the FEMC256GBE-T740 provides an integrated storage solution that simplifies board design while meeting the demanding requirements of industrial applications. Its eMMC 5.1 interface ensures broad compatibility with modern embedded processors and SoCs, making it an ideal choice for applications where performance, capacity, and environmental resilience are critical.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) user capacity organized as 256G × 8, providing ample storage for firmware, operating systems, data logging, and multimedia content in embedded applications.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 interface operating at up to 200 MHz clock frequency ensures broad compatibility with host processors and enables efficient data transfer rates for demanding applications.
• Advanced 3D TLC Technology
  Built using 3D TLC (Triple-Level Cell) NAND flash technology, delivering excellent storage density and performance characteristics in a cost-effective memory solution.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance in harsh environmental conditions typical of industrial, transportation, and outdoor deployments.
• Flexible Voltage Support
  Dual voltage supply support with VCC at 3.3V and VCCQ at either 1.8V or 3.3V, providing flexibility for integration with various host system architectures and power designs.
• Compact Surface-Mount Package
  153-ball FBGA (Fine-pitch Ball Grid Array) surface-mount package minimizes board space while providing a robust mechanical connection suitable for high-vibration and shock environments.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

• Industrial Control Systems
  Provides reliable storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and factory automation equipment requiring non-volatile data retention and rugged operation.
• Edge Computing and IoT Gateways
  Delivers the capacity and performance needed for edge processing applications, data buffering, and local analytics in distributed IoT architectures.
• Medical Equipment
  Suitable for medical diagnostic devices, patient monitoring systems, and imaging equipment where dependable storage and industrial-grade reliability are essential.
• Transportation and Fleet Management
  Enables data logging, route recording, and system storage for vehicle tracking systems, telematics, and transportation infrastructure equipment operating in extended temperature environments.
• Digital Signage and Kiosks
  Supports multimedia content storage and operating system requirements for commercial displays, interactive kiosks, and point-of-sale terminals.

Unique Advantages

• Proven Industrial-Grade Reliability:
  With an extended operating temperature range and industrial qualification, this eMMC module is engineered for continuous operation in demanding environments where consumer-grade solutions would fail.
• Simplified System Integration:
  The standardized eMMC 5.1 interface eliminates the need for complex NAND controller design, reducing development time, board complexity, and overall system cost.
• Scalable Storage Architecture:
  As part of the XTRA VII Series offering capacities from 8GB to 256GB, designers can select the optimal storage capacity for their application while maintaining design consistency across product lines.
• Space-Efficient Design:
  The compact 153-ball FBGA footprint delivers high storage capacity in minimal board space, critical for size-constrained embedded designs.
• Comprehensive Voltage Flexibility:
  Dual VCCQ voltage support (1.8V/3.3V) facilitates integration with both legacy and modern processor platforms without requiring additional level-shifting circuitry.
• Trusted Manufacturing:
  Manufactured by Flexxon with rigorous quality control and full RoHS compliance, ensuring consistent supply and adherence to global environmental standards.

Why Choose the FEMC256GBE-T740?

The FEMC256GBE-T740 combines high-capacity storage, industrial-grade reliability, and broad compatibility in a proven eMMC 5.1 package. Its 256GB capacity addresses the growing storage requirements of modern embedded systems while its extended temperature rating and robust construction ensure dependable operation in challenging industrial environments. The standardized interface and compact form factor accelerate time-to-market by simplifying hardware design and reducing validation cycles.

For engineers developing industrial equipment, edge computing platforms, transportation systems, or any embedded application requiring substantial non-volatile storage with proven environmental resilience, the FEMC256GBE-T740 delivers the capacity, performance, and reliability essential for long-term deployment success. Backed by Flexxon's commitment to quality and supported by comprehensive technical documentation, this eMMC solution provides the foundation for robust embedded storage architectures.

Ready to integrate reliable, high-capacity storage into your next embedded design? Request a quote for the FEMC256GBE-T740 today or contact our technical sales team to discuss your specific application requirements and volume pricing options.