FEMC256GBB-T740

The FEMC256GBB-T740 from Flexxon is a high-capacity 256GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution engineered for demanding automotive and industrial applications. Built on advanced 3D TLC NAND technology and packaged in a compact 153-ball FBGA, this memory device delivers reliable non-volatile storage with dual voltage supply support. As part of the XTRA VIII series, it combines substantial storage capacity with automotive-grade qualification to meet the rigorous requirements of temperature-sensitive and mission-critical embedded systems.

With AEC-Q100 Grade 2 qualification and an extended operating temperature range of -40°C to 105°C, the FEMC256GBB-T740 is designed to perform consistently in harsh environments where standard consumer-grade memory would fail. The eMMC 5.1 interface supports clock frequencies up to 200 MHz, enabling efficient data transfer for applications ranging from automotive infotainment and telematics to industrial control systems and edge computing platforms.

Key Features

• High-Capacity 3D TLC NAND Flash
  256GB (2.048 Tbit) storage capacity organized as 256G × 8, providing ample space for operating systems, applications, data logging, multimedia content, and firmware storage in embedded systems.
• eMMC 5.1 Interface
  Industry-standard embedded MultiMediaCard interface with 200 MHz clock frequency support, ensuring broad host controller compatibility and efficient data throughput for read/write operations.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 certified for automotive applications with an extended operating temperature range of -40°C to 105°C, ensuring reliable operation in under-hood automotive environments and industrial installations exposed to temperature extremes.
• Dual Voltage Supply Support
  Flexible power supply configuration with VCCQ support for both 1.8V and 3.3V signaling levels and VCC at 3.3V, allowing integration with a wide range of host processor I/O voltage standards and reducing design complexity.
• 3D TLC NAND Technology
  Advanced three-dimensional triple-level cell NAND architecture delivers higher storage density and improved cost-per-gigabyte compared to planar NAND, while maintaining reliable performance for embedded applications.
• Compact 153-Ball FBGA Package
  Surface-mount 153-FBGA package optimizes board space utilization in space-constrained embedded designs while providing robust mechanical connection and thermal performance for automotive and industrial environments.
• RoHS Compliant
  Fully compliant with environmental regulations, supporting sustainable manufacturing practices and meeting global market requirements for hazardous substance restrictions.

Typical Applications

• Automotive Infotainment Systems
  Ideal for storing operating systems, navigation maps, multimedia content, and user data in dashboard displays, head units, and rear-seat entertainment systems where automotive qualification and temperature tolerance are essential.
• Advanced Driver Assistance Systems (ADAS)
  Provides reliable storage for firmware, calibration data, and event logging in camera systems, sensor fusion modules, and electronic control units that require automotive-grade components with extended temperature operation.
• Industrial Control and Automation
  Well-suited for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and edge computing gateways that operate in factory environments with wide temperature variations and require long-term data retention.
• Telematics and Fleet Management
  Supports vehicle tracking systems, fleet management devices, and connected car applications that demand robust storage for GPS data, diagnostic information, and communication logs in automotive operating conditions.
• Edge Computing and IoT Gateways
  Enables data collection, local processing, and buffering in industrial IoT edge devices and gateway appliances that require high-capacity storage with reliability across extended temperature ranges.

Unique Advantages

• Automotive-Qualified Reliability: AEC-Q100 Grade 2 certification ensures the component meets stringent automotive industry standards for quality, reliability, and environmental stress testing, reducing risk in safety-critical applications.
• Extended Temperature Operation: The -40°C to 105°C operating range enables deployment in harsh automotive and industrial environments without requiring additional thermal management, simplifying system design and reducing costs.
• High Storage Density: 256GB capacity in a compact footprint eliminates the need for multiple memory devices or external storage, reducing BOM complexity, board space requirements, and overall system cost.
• Flexible Voltage Compatibility: Dual VCCQ voltage support (1.8V/3.3V) provides design flexibility to interface directly with modern low-voltage processors or legacy 3.3V systems without additional level shifters or converters.
• Industry-Standard Interface: eMMC 5.1 compatibility ensures seamless integration with a broad ecosystem of embedded processors, reducing software development effort and enabling faster time-to-market with proven drivers and middleware.
• Proven 3D NAND Technology: Mature 3D TLC NAND manufacturing delivers a balance of capacity, cost-effectiveness, and reliability for embedded applications that require substantial storage without the premium cost of SLC or pSLC solutions.

Why Choose the FEMC256GBB-T740?

The FEMC256GBB-T740 represents a compelling choice for engineers designing automotive and industrial systems that demand both high storage capacity and proven environmental resilience. Its AEC-Q100 Grade 2 qualification and extended -40°C to 105°C operating range make it particularly well-suited for applications where temperature stress, vibration, and long-term reliability are critical design considerations. The combination of 256GB capacity, industry-standard eMMC 5.1 interface, and compact 153-ball FBGA packaging addresses the needs of modern embedded systems that must balance increasing storage requirements with strict space and reliability constraints.

For system architects and procurement teams seeking a reliable, automotive-qualified memory solution backed by Flexxon's expertise in industrial and automotive storage, the FEMC256GBB-T740 offers a proven foundation. Its flexible voltage support, mature 3D TLC technology, and standards-based interface ensure compatibility with current and future designs while maintaining the robustness required for deployment in demanding real-world conditions. Whether you're developing next-generation automotive electronics or industrial edge devices, this memory solution delivers the capacity and qualification necessary for long product lifecycles.

Ready to integrate the FEMC256GBB-T740 into your next automotive or industrial design? Request a quote today to discuss pricing, availability, and technical support for your specific application requirements. Our team is ready to provide detailed specifications and assist with design integration to ensure successful deployment in your embedded system.