FEMC256GBA-E540
| Part Description |
FEMC256GBA-E540 256GB eMMC 5.1 3D TLC |
|---|---|
| Quantity | 532 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2.048 Tbit | Grade | Automotive grade 3 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 256G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC256GBA-E540 – 256GB Automotive-Grade eMMC 5.1 Flash Memory
The FEMC256GBA-E540 is a high-capacity 256GB embedded multimedia card (eMMC 5.1) flash memory module from Flexxon's AXO series, designed to meet the demanding requirements of automotive and industrial applications. Built on 3D TLC NAND technology and housed in a compact 153-ball FBGA package, this non-volatile memory solution delivers reliable, high-speed data storage with eMMC 5.1 interface capabilities operating at 200 MHz.
Qualified to AEC-Q100 Grade 3 standards and rated for automotive-grade operation from -25°C to 85°C, the FEMC256GBA-E540 provides a robust storage foundation for automotive infotainment systems, advanced driver assistance systems, industrial controllers, and embedded computing platforms where durability, performance, and compliance are critical.
Key Features
- High-Capacity 3D TLC NAND Storage
256GB (2.048 Tbit) of non-volatile flash memory organized as 256G × 8, delivering ample storage for multimedia content, data logging, firmware, and application code in space-constrained embedded designs. - eMMC 5.1 Interface with 200 MHz Clock
Industry-standard eMMC 5.1 protocol ensures broad compatibility with modern processors and SoCs while delivering high-speed data throughput for read-intensive and write-intensive workloads. - Automotive-Grade Qualification (AEC-Q100 Grade 3)
Meets AEC-Q100 Grade 3 reliability standards, ensuring robust performance and longevity in automotive environments with rigorous thermal, electrical, and environmental stress testing. - Extended Operating Temperature Range
Rated for -25°C to 85°C operation, making it suitable for automotive cockpit, industrial control, and outdoor equipment applications where ambient temperature fluctuations are common. - Flexible Voltage Supply
Supports dual VCCQ voltage levels (1.8V/3.3V) and 3.3V VCC, providing design flexibility and compatibility with a wide range of host processors and system architectures. - Compact 153-Ball FBGA Package
Surface-mount 153-FBGA package enables high-density PCB layouts and efficient use of board real estate in space-critical applications. - RoHS Compliant
Fully compliant with RoHS environmental standards, supporting sustainable design practices and global regulatory requirements.
Typical Applications
- Automotive Infotainment Systems
Stores operating systems, navigation maps, multimedia libraries, and user data in dashboard displays and head units, leveraging automotive-grade reliability and ample capacity for rich user experiences. - Advanced Driver Assistance Systems (ADAS)
Provides non-volatile storage for firmware, calibration data, and event logging in vision processors, sensor fusion modules, and electronic control units requiring AEC-Q100 qualification. - Industrial Controllers and IoT Gateways
Serves as embedded storage for firmware, configuration files, and operational data in programmable logic controllers, human-machine interfaces, and edge computing devices operating in harsh industrial environments. - Commercial and Transportation Equipment
Enables reliable data logging, multimedia playback, and system boot in fleet management systems, digital signage, point-of-sale terminals, and ruggedized mobile computing platforms.
Unique Advantages
- Automotive-Qualified Reliability:
AEC-Q100 Grade 3 qualification ensures the FEMC256GBA-E540 meets stringent automotive industry standards for component reliability, reducing risk in safety-critical and mission-critical designs. - High-Density Storage in Proven Package:
256GB capacity in a compact 153-ball FBGA footprint maximizes data storage while minimizing PCB space, enabling sleeker product designs without sacrificing functionality. - Broad Thermal Operating Window:
-25°C to 85°C operating range supports deployment in automotive cabin, engine bay (Grade 3), and industrial enclosure environments where temperature extremes are a design concern. - Standardized eMMC 5.1 Interface:
Leverages widely adopted eMMC 5.1 protocol for seamless integration with existing processor platforms, reducing development time and simplifying firmware porting across product lines. - Flexible I/O Voltage Support:
Dual VCCQ options (1.8V/3.3V) accommodate diverse system power architectures, enabling compatibility with both legacy and modern low-power processor designs. - Environmental Compliance:
RoHS-compliant construction aligns with global environmental regulations and corporate sustainability goals, supporting responsible supply chain management.
Why Choose the FEMC256GBA-E540?
The FEMC256GBA-E540 combines automotive-grade qualification, generous storage capacity, and a proven eMMC 5.1 interface in a compact, robust package. Designed for engineers developing automotive infotainment, ADAS, industrial control, and embedded computing systems, this memory module delivers the reliability, performance, and compliance required in demanding applications. Its AEC-Q100 Grade 3 qualification and extended temperature range provide confidence in long-term operation, while the standardized eMMC interface and dual voltage support simplify integration and future-proof your design.
Whether you're architecting next-generation automotive systems or ruggedized industrial equipment, the FEMC256GBA-E540 offers a proven storage solution backed by Flexxon's expertise in automotive and industrial memory products, helping you meet project timelines and reliability targets with confidence.
Ready to integrate the FEMC256GBA-E540 into your next design? Contact our sales team today to request a quote, discuss volume pricing, or obtain engineering samples for your evaluation and testing requirements.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015