FEMC256GBA-T740

The FEMC256GBA-T740 from Flexxon is a high-capacity 256GB embedded MultiMediaCard (eMMC) storage solution built on advanced 3D TLC NAND technology. Designed to meet the demanding requirements of automotive and industrial applications, this eMMC 5.1 module combines substantial storage capacity with robust reliability and AEC-Q100 Grade 3 qualification. Operating across an extended temperature range of -40°C to 85°C, the FEMC256GBA-T740 delivers dependable non-volatile flash memory storage in a compact 153-ball FBGA surface-mount package.

Part of Flexxon's XTRA VIII Series, this automotive-grade memory module provides designers with a proven storage solution for data-intensive embedded systems. With its 200 MHz clock frequency, dual voltage supply support (1.8V/3.3V VCCQ, 3.3V VCC), and standardized eMMC 5.1 interface, the FEMC256GBA-T740 simplifies integration while offering the storage capacity and performance needed for modern connected devices, infotainment systems, and edge computing applications.

Key Features

• High-Capacity 3D TLC NAND Storage
  256GB (2.048 Tbit) capacity organized as 256G × 8, providing ample space for operating systems, applications, multimedia content, and data logging in embedded systems.
• eMMC 5.1 Interface Standard
  Industry-standard eMMC 5.1 interface with 200 MHz clock frequency ensures broad compatibility with modern host processors and simplified integration into existing designs.
• Automotive-Grade Reliability
  AEC-Q100 Grade 3 qualified for automotive applications, meeting stringent quality and reliability requirements for vehicular environments and mission-critical industrial systems.
• Extended Temperature Operation
  Operates reliably across -40°C to 85°C temperature range, suitable for harsh environmental conditions in automotive, industrial control, and outdoor equipment applications.
• Flexible Voltage Support
  Dual voltage I/O support (VCCQ: 1.8V/3.3V) with 3.3V core supply (VCC) enables compatibility with a wide range of host system architectures and reduces design complexity.
• Compact Surface-Mount Package
  153-ball FBGA package provides a space-efficient footprint for embedded designs where board real estate is at a premium, while ensuring reliable surface-mount assembly.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting environmentally responsible product development and global market access.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation maps, multimedia libraries, user profiles, and operating system files in vehicle head units and dashboard displays.
• Industrial Control and Automation
  Enables data logging, firmware storage, and configuration management in programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial edge devices operating in harsh environments.
• Medical and Healthcare Devices
  Supports secure data storage for patient information, diagnostic images, and device firmware in portable medical equipment and bedside monitoring systems requiring reliable non-volatile memory.
• Transportation and Telematics
  Stores critical data for fleet management systems, GPS tracking devices, and vehicle telemetry applications where extended temperature operation and automotive qualification are essential.
• Smart City Infrastructure
  Powers storage requirements for intelligent traffic systems, surveillance cameras, and edge computing nodes deployed in outdoor environments with wide temperature variations.

Unique Advantages

• Automotive-Qualified Peace of Mind: AEC-Q100 Grade 3 certification ensures the FEMC256GBA-T740 meets automotive industry quality standards, reducing qualification time and risk for vehicular applications.
• Proven 3D TLC Technology: Advanced 3D TLC NAND architecture delivers the optimal balance of storage density, cost-effectiveness, and reliability for high-capacity embedded storage applications.
• Simplified System Integration: Standard eMMC 5.1 interface with comprehensive register support (OCR, CID, CSD, Extended CSD) streamlines software integration and accelerates time-to-market.
• Wide Operating Voltage Range: Flexible VCCQ voltage support (1.8V/3.3V) accommodates diverse system architectures without requiring additional level-shifting circuitry, reducing BOM costs.
• Extended Environmental Performance: -40°C to 85°C operating temperature range ensures consistent performance across seasonal variations and demanding industrial environments without thermal management concerns.
• Space-Efficient Design: Compact 153-ball FBGA footprint maximizes available board space for other components while maintaining robust electrical and mechanical connections through surface-mount technology.

Why Choose the FEMC256GBA-T740?

The FEMC256GBA-T740 represents a comprehensive embedded storage solution that combines high capacity, automotive-grade reliability, and industry-standard interfacing in a single component. For design engineers working on automotive, industrial, or rugged embedded systems, this eMMC module eliminates the complexity of managing discrete NAND flash while providing the storage capacity needed for feature-rich modern applications. The AEC-Q100 Grade 3 qualification and extended temperature operation provide confidence in demanding deployment environments.

Backed by Flexxon's expertise in embedded memory solutions and the proven XTRA VIII Series architecture, the FEMC256GBA-T740 offers long-term supply stability and technical support for production programs. Whether you're designing next-generation automotive infotainment systems, industrial IoT gateways, or ruggedized medical devices, this 256GB eMMC 5.1 module delivers the performance, reliability, and capacity your application demands.

Ready to integrate the FEMC256GBA-T740 into your next design? Contact our sales team today to request detailed pricing, availability information, and technical support for your specific application requirements. Our engineering team is available to assist with integration questions and provide guidance on optimizing system performance.