FEMC256GBB-E530

The FEMC256GBB-E530 is a high-capacity 256GB embedded MultiMediaCard (eMMC 5.1) from Flexxon's AXO Series, designed to deliver reliable non-volatile storage for demanding industrial and automotive applications. Built with 3D TLC NAND flash technology and featuring a JEDEC-compliant eMMC 5.1 interface operating at 200 MHz, this component combines substantial storage capacity with proven standards compliance. Qualified to AEC-Q100 Grade 2 automotive standards and rated for extended temperature operation from -25°C to 85°C, the FEMC256GBB-E530 provides designers with a robust storage solution for systems requiring both performance and environmental resilience.

Housed in a compact 100-ball FBGA surface-mount package, this 256GB eMMC module integrates an embedded flash controller with 3D TLC NAND in a single component, simplifying board design while reducing component count. With dual voltage support (VCCQ: 1.8V/3.3V, VCC: 3.3V) and full RoHS compliance, the FEMC256GBB-E530 addresses the storage requirements of automotive infotainment systems, industrial control equipment, transportation systems, and other applications where reliability, capacity, and temperature tolerance are critical.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) storage capacity organized as 256G × 8, providing ample space for data logging, firmware, multimedia content, and application files in embedded systems.
• eMMC 5.1 Interface
  JEDEC-compliant eMMC 5.1 interface operating at 200 MHz clock frequency delivers standardized communication protocols and reliable data transfer for embedded applications.
• 3D TLC NAND Technology
  Utilizes 3D TLC (Triple-Level Cell) flash memory technology for high-density storage in a compact form factor, balancing capacity and cost-effectiveness.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 qualified for automotive applications, meeting stringent reliability and quality standards required in vehicular environments.
• Extended Temperature Range
  Operates reliably across -25°C to 85°C, supporting deployment in industrial control systems, outdoor equipment, and automotive applications subject to wide temperature variations.
• Dual Voltage Support
  Flexible voltage supply options with VCCQ supporting both 1.8V and 3.3V levels, and VCC at 3.3V, facilitating integration into diverse system architectures.
• Compact Surface-Mount Package
  100-ball FBGA (Fine-pitch Ball Grid Array) package offers a small footprint for space-constrained PCB layouts while maintaining robust electrical connections.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, meeting regulatory requirements for lead-free manufacturing and reducing environmental impact.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation databases, multimedia content, user preferences, and system firmware in modern vehicle infotainment platforms requiring AEC-Q100 Grade 2 qualification.
• Industrial Control and Automation
  Stores configuration data, operational logs, and firmware for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial IoT devices operating in extended temperature environments.
• Transportation and Fleet Management
  Enables data logging, route recording, and video storage in commercial vehicle systems, fleet telematics devices, and railway control equipment requiring reliable operation across temperature extremes.
• Medical Equipment
  Supports patient data storage, diagnostic imaging, and device configuration in medical instrumentation requiring non-volatile memory with proven reliability standards.
• Smart City Infrastructure
  Provides storage for intelligent traffic control systems, environmental monitoring stations, and outdoor surveillance equipment operating in uncontrolled temperature environments.

Unique Advantages

• Integrated Controller and Flash
  Combines flash controller and NAND memory in a single component, eliminating the need for external controller circuitry and reducing PCB complexity, component count, and overall system cost.
• Standards-Based Interoperability
  Full compliance with JEDEC eMMC 5.1 standard ensures broad compatibility with host processors and simplifies firmware development using established industry protocols and widely available software support.
• Automotive-Qualified Reliability
  AEC-Q100 Grade 2 qualification provides documented reliability testing and quality assurance specifically for automotive applications, reducing risk and accelerating time to market for vehicular systems.
• Wide Operating Temperature Window
  -25°C to 85°C operation range enables deployment in challenging thermal environments without requiring active cooling or thermal management systems, expanding application possibilities for outdoor and industrial installations.
• Simplified Power Design
  Dual voltage support for VCCQ (1.8V/3.3V) allows designers to match existing system power rails, reducing the need for additional voltage regulators and streamlining power supply architecture.
• Space-Efficient Form Factor
  100-ball FBGA package delivers 256GB capacity in a compact footprint suitable for space-constrained designs such as automotive modules, handheld devices, and embedded systems with tight PCB real estate.

Why Choose the FEMC256GBB-E530?

The FEMC256GBB-E530 represents a proven solution for engineers developing embedded systems requiring substantial non-volatile storage with automotive-grade reliability. By combining 256GB capacity with AEC-Q100 Grade 2 qualification and extended temperature operation, this eMMC module addresses the stringent requirements of automotive, industrial, and transportation applications where component reliability directly impacts system uptime and safety. The JEDEC eMMC 5.1 interface ensures straightforward integration with existing host processors, while the integrated controller architecture simplifies design and reduces external component requirements.

For design teams working on next-generation infotainment systems, industrial control platforms, or fleet management solutions, the FEMC256GBB-E530 offers the combination of capacity, qualification, and temperature tolerance necessary for demanding environments. The compact 100-ball FBGA package supports miniaturization efforts, while RoHS compliance ensures regulatory alignment. Whether you're developing automotive systems requiring AEC-Q100 qualification or industrial equipment operating in harsh thermal conditions, this eMMC solution from Flexxon's AXO Series delivers the storage performance and reliability foundation your application demands.

Get Started Today

Ready to integrate the FEMC256GBB-E530 into your next design? Request a quote today to discuss pricing, availability, and technical support for your specific application requirements. Our team can provide detailed technical documentation and assist with integration planning to help you bring your product to market with confidence.