FEMC256GBB-E540

The FEMC256GBB-E540 is a high-capacity 256GB embedded MultiMediaCard (eMMC 5.1) storage solution from Flexxon's AXO series, designed to deliver reliable non-volatile flash memory for demanding embedded applications. Built on 3D TLC NAND technology in a compact 153-ball FBGA package, this memory device provides robust performance with a 200 MHz clock frequency and supports both 1.8V and 3.3V I/O voltage levels for flexible system integration.

Qualified to AEC-Q100 Grade 2 automotive standards and rated for -25°C to 85°C operation, the FEMC256GBB-E540 is engineered for applications requiring high-density storage, proven reliability, and extended temperature tolerance. Its eMMC 5.1 interface ensures broad compatibility with modern processors and controllers across automotive, industrial, and embedded computing platforms.

Key Features

• High-Capacity 3D TLC Flash Storage
  Delivers 256GB (2.048 Tbit) of non-volatile memory organized as 256G × 8, providing ample storage for data logging, multimedia content, firmware, and application code in space-constrained embedded systems.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 protocol operating at 200 MHz clock frequency ensures fast data throughput and seamless integration with a wide range of host processors and system-on-chip platforms.
• Flexible Voltage Supply
  Supports dual I/O voltage operation (VCCQ: 1.8V/3.3V) with VCC at 3.3V, enabling compatibility with both legacy and modern low-voltage systems while simplifying power supply design.
• AEC-Q100 Grade 2 Qualified
  Meets automotive-grade quality and reliability standards with AEC-Q100 Grade 2 qualification, ensuring consistent performance in demanding environments with extended temperature exposure.
• Extended Temperature Range
  Operates reliably across -25°C to 85°C, making it suitable for automotive, industrial control, and outdoor applications where ambient conditions vary significantly.
• Compact Surface-Mount Package
  153-ball FBGA form factor minimizes PCB footprint and enables high-density board layouts, ideal for space-critical designs in automotive infotainment, telematics, and embedded computing modules.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation maps, multimedia libraries, user profiles, and over-the-air update packages in dashboard displays and rear-seat entertainment systems operating across wide temperature ranges.
• Telematics and Fleet Management
  Enables reliable data logging, GPS tracking, and communication module storage in connected vehicle platforms where automotive-grade reliability and extended temperature tolerance are essential.
• Industrial Control and Automation
  Supports firmware storage, operational data logging, and human-machine interface (HMI) content in programmable logic controllers, industrial PCs, and factory automation equipment exposed to harsh environmental conditions.
• Embedded Computing Platforms
  Serves as primary or secondary storage in single-board computers, gateway devices, and edge computing nodes requiring non-volatile, high-capacity memory with proven reliability standards.
• Medical and Diagnostic Equipment
  Stores patient data, diagnostic images, and application software in portable and stationary medical devices where data integrity and temperature resilience are critical.

Unique Advantages

• Automotive-Grade Reliability:
  AEC-Q100 Grade 2 qualification and extended temperature operation ensure consistent performance in demanding automotive and industrial environments, reducing field failure risks and warranty costs.
• High Storage Density:
  256GB capacity based on 3D TLC technology provides substantial headroom for growing data requirements, future-proofing designs against evolving content and application storage demands.
• Proven eMMC Standard:
  eMMC 5.1 interface compatibility simplifies hardware and software integration, leveraging existing driver support and reducing development time across multiple processor families and operating systems.
• Dual Voltage Flexibility:
  Support for both 1.8V and 3.3V I/O voltages accommodates diverse system architectures and power budgets, eliminating the need for voltage translation circuitry and simplifying power supply design.
• Compact Footprint:
  153-ball FBGA package delivers high capacity in minimal board space, enabling denser product designs and supporting miniaturization trends in automotive, industrial, and portable applications.
• Environmental Compliance:
  RoHS-compliant construction aligns with global environmental regulations and corporate sustainability goals, facilitating market access and supply chain transparency.

Why Choose the FEMC256GBB-E540?

The FEMC256GBB-E540 combines automotive-grade qualification, high-capacity 3D TLC storage, and a proven eMMC 5.1 interface to deliver a robust, flexible embedded memory solution for demanding applications. Its AEC-Q100 Grade 2 certification and -25°C to 85°C operating range provide the reliability required in automotive and industrial environments, while 256GB of storage capacity accommodates the growing data demands of modern connected systems. The dual-voltage I/O support and compact 153-ball FBGA package further enhance design flexibility and board-level integration.

Whether you're developing next-generation automotive infotainment systems, industrial automation platforms, or ruggedized embedded computing solutions, the FEMC256GBB-E540 offers a dependable foundation for non-volatile storage. Backed by Flexxon's AXO series heritage and compliance with global environmental standards, this eMMC module delivers long-term value through proven technology, broad compatibility, and field-proven resilience.

Ready to integrate reliable, high-capacity embedded storage into your next design? Request a quote today to learn more about pricing, availability, and how the FEMC256GBB-E540 can meet your application requirements.