FEMC256GBE-E540

The FEMC256GBE-E540 is a high-capacity 256GB embedded MultiMediaCard (eMMC 5.1) from Flexxon's AXO series, delivering reliable non-volatile flash storage in a compact 153-ball FBGA package. Built with advanced 3D TLC NAND technology, this industrial-grade memory module provides substantial storage capacity with the performance and interface standards required for embedded applications. Operating across an industrial temperature range of -25°C to 85°C, the FEMC256GBE-E540 is engineered for demanding environments where reliable data retention and high-speed access are critical.

With its eMMC 5.1 interface running at 200 MHz clock frequency and flexible voltage supply options, this 256GB memory solution offers embedded system designers a proven storage platform that balances capacity, performance, and environmental resilience. The surface-mount 153-FBGA format enables space-efficient integration into compact industrial devices, communication equipment, and embedded computing platforms.

Key Features

• High-Capacity 3D TLC Flash Storage
  256GB (2.048 Tbit) of non-volatile flash memory utilizing 3D TLC NAND technology provides substantial storage capacity for data-intensive embedded applications, supporting large operating systems, multimedia content, logging, and application data.
• eMMC 5.1 Interface with 200 MHz Operation
  Standards-compliant eMMC 5.1 interface operating at 200 MHz clock frequency delivers high-bandwidth data transfer for responsive system performance and efficient read/write operations in embedded platforms.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance in industrial control systems, outdoor equipment, transportation devices, and other applications exposed to extended temperature conditions.
• Flexible Voltage Supply
  Dual voltage support with VCCQ at 1.8V/3.3V and VCC at 3.3V provides compatibility with a wide range of embedded processor platforms and system architectures, simplifying integration across diverse design requirements.
• Compact 153-Ball FBGA Package
  Surface-mount 153-FBGA package delivers high I/O density in a space-efficient footprint, enabling compact board layouts and integration into size-constrained embedded devices.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, meeting regulatory requirements for commercial and industrial deployment worldwide.

Typical Applications

• Industrial Control and Automation
  Provides reliable data storage for industrial PLCs, HMI panels, and factory automation controllers that require persistent storage for operating systems, configuration data, and production logs in harsh environmental conditions.
• Embedded Computing Platforms
  Serves as primary storage for single-board computers, embedded Linux systems, and IoT gateways where substantial capacity is needed for applications, databases, and firmware alongside industrial temperature tolerance.
• Communication Infrastructure
  Enables data retention and firmware storage in networking equipment, routers, and telecommunications devices that demand high-capacity persistent memory with reliable operation across varying environmental conditions.
• Transportation and Fleet Management
  Supports onboard computing systems, telematics devices, and vehicle data recorders that require high-capacity storage capable of withstanding extended temperature ranges and continuous operation.
• Digital Signage and Kiosk Systems
  Provides ample storage for multimedia content, operating systems, and application data in commercial display systems and interactive kiosks deployed in indoor and semi-outdoor environments.

Unique Advantages

• Proven eMMC 5.1 Standard: Leverages the widely adopted eMMC 5.1 specification, ensuring broad compatibility with existing embedded processor ecosystems, reducing integration risk and accelerating time-to-market.
• Industrial-Grade Reliability: The -25°C to 85°C operating temperature qualification ensures consistent performance in challenging environmental conditions where consumer-grade storage would fail, reducing field failures and maintenance costs.
• Simplified Integration: The standardized eMMC interface and flexible voltage support eliminate the need for complex controller circuitry or software drivers, streamlining board design and reducing bill-of-materials complexity.
• Scalable Platform: As part of Flexxon's AXO 5.1 series spanning 16GB to 512GB capacities, designers can leverage a common footprint and interface across product variants, enabling scalable product families with minimal redesign.
• Space-Efficient Design: The compact 153-ball FBGA surface-mount package maximizes board space utilization, critical for embedded applications where PCB real estate is constrained or multiple subsystems must coexist on a single board.
• 3D NAND Technology Foundation: Built on 3D TLC NAND architecture, this memory module benefits from advanced manufacturing processes that deliver higher density and improved reliability compared to planar flash technologies.

Why Choose the FEMC256GBE-E540?

The FEMC256GBE-E540 represents a robust storage solution for embedded system designers who require industrial-grade reliability combined with high capacity and standards-based integration. With 256GB of 3D TLC flash memory, eMMC 5.1 interface performance, and qualification across the industrial temperature range, this module addresses the storage requirements of demanding applications without the complexity of managing discrete NAND flash components. The flexible voltage support and compact FBGA package further enhance design flexibility, enabling integration across diverse embedded platforms.

For engineers developing industrial controllers, embedded computing systems, communication infrastructure, or transportation electronics, the FEMC256GBE-E540 delivers the balance of capacity, environmental resilience, and proven interface standards essential for long product lifecycles. Backed by Flexxon's AXO series platform and RoHS compliance, this memory module provides a dependable foundation for current designs while offering scalability options as storage requirements evolve.

Ready to integrate industrial-grade 256GB eMMC storage into your next embedded design? Request a quote today to discuss your application requirements and receive detailed pricing and availability information for the FEMC256GBE-E540.