FEMC512GBB-E530
| Part Description |
FEMC512GBB-E530 512GB eMMC 5.1 3D TLC |
|---|---|
| Quantity | 1,534 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 100-FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4.096 Tbit | Grade | Automotive grade 2 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 100-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 512G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 2 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC512GBB-E530 – 512GB Automotive-Grade eMMC 5.1 Memory Module
The FEMC512GBB-E530 is a high-capacity 512GB embedded MultiMediaCard (eMMC) 5.1 memory module from Flexxon's AXO Series, engineered with 3D TLC NAND flash technology. This automotive-qualified storage solution combines an embedded flash controller with 3D TLC NAND in a compact 100-ball FBGA package, fully compliant with JEDEC eMMC 5.1 standards. Operating at 200 MHz clock frequency with dual voltage support (1.8V/3.3V VCCQ, 3.3V VCC), this module delivers reliable non-volatile storage for demanding automotive and industrial applications.
Qualified to AEC-Q100 Grade 2 standards and rated for -25°C to 85°C operation, the FEMC512GBB-E530 provides embedded systems designers with a robust, automotive-grade memory solution that meets stringent reliability requirements. Its surface-mount 100-FBGA package enables space-efficient integration while the eMMC 5.1 interface ensures compatibility with a wide range of host controllers.
Key Features
- High-Capacity Storage
512GB (4.096 Tbit) of embedded flash memory organized as 512G × 8, providing substantial storage capacity for data logging, multimedia content, firmware, and application code in automotive and industrial systems. - 3D TLC NAND Technology
Utilizes advanced 3D TLC (Triple-Level Cell) flash technology for enhanced storage density and cost-efficiency, delivering reliable non-volatile memory performance in a compact form factor. - eMMC 5.1 Standard Interface
Fully compliant with JEDEC eMMC 5.1 specifications, ensuring broad compatibility with modern embedded processors and microcontrollers. Operates at 200 MHz clock frequency for efficient data throughput. - Automotive-Qualified Reliability
AEC-Q100 Grade 2 qualified for automotive applications with extended temperature range operation from -25°C to 85°C, suitable for in-cabin automotive systems and demanding industrial environments. - Flexible Voltage Support
Dual I/O voltage support (VCCQ: 1.8V/3.3V) with 3.3V core supply (VCC), enabling integration with both legacy and modern embedded system architectures without additional level-shifting circuitry. - Compact Surface-Mount Package
Industry-standard 100-ball FBGA package optimized for surface-mount assembly, minimizing board space requirements while providing reliable solder joint connections for high-vibration environments. - RoHS Compliant
Fully compliant with RoHS environmental regulations, meeting global requirements for hazardous substance restrictions in electronic components.
Typical Applications
- Automotive Infotainment Systems
High-capacity storage for multimedia content, navigation maps, user interface assets, and system firmware in in-vehicle infotainment platforms requiring automotive-grade reliability. - Advanced Driver Assistance Systems (ADAS)
Data logging and storage for sensor fusion data, calibration parameters, and software updates in ADAS applications operating within the -25°C to 85°C temperature range. - Industrial Control and Automation
Embedded storage for HMI applications, data acquisition systems, and programmable logic controllers requiring reliable non-volatile memory in industrial temperature environments. - Automotive Digital Clusters
Storage solution for high-resolution graphics, user customization data, and system software in next-generation digital instrument clusters and reconfigurable displays. - Connected Vehicle Systems
Robust storage for over-the-air update packages, vehicle diagnostics data, and connectivity module firmware in telematics and V2X communication systems.
Unique Advantages
- Automotive-Grade Qualification:
AEC-Q100 Grade 2 certification provides the reliability assurance required for automotive tier-1 suppliers and OEMs, reducing qualification time and ensuring compliance with automotive supply chain requirements. - Simplified Integration:
JEDEC eMMC 5.1 standard interface eliminates the need for external NAND controllers and associated firmware development, accelerating time-to-market while reducing design complexity and BOM costs. - Extended Temperature Performance:
-25°C to 85°C operating range covers automotive Grade 2 requirements for in-cabin applications and industrial control systems, providing reliable operation across diverse environmental conditions. - Scalable Capacity Options:
Part of Flexxon's AXO 5.1 Series (16GB to 512GB), enabling design scalability across multiple product tiers and platforms while maintaining consistent interface, footprint, and qualification status. - Dual Voltage Compatibility:
Support for both 1.8V and 3.3V I/O voltages provides design flexibility for integration with various processor families and system architectures without requiring additional voltage translation components. - Proven 3D TLC Technology:
Mature 3D TLC NAND technology delivers a balanced combination of storage density, endurance, and cost-effectiveness suitable for embedded automotive and industrial applications with managed write workloads.
Why Choose FEMC512GBB-E530?
The FEMC512GBB-E530 offers embedded systems designers a fully-qualified, automotive-grade storage solution that combines high capacity with industry-standard eMMC 5.1 compatibility. Its AEC-Q100 Grade 2 qualification and extended temperature range make it particularly well-suited for automotive applications where reliability and compliance are paramount, while the JEDEC-standard interface ensures straightforward integration with existing embedded platforms. The 512GB capacity addresses the growing storage demands of modern automotive infotainment, ADAS, and connected vehicle systems.
For design teams seeking a reliable, standards-based embedded storage solution that meets automotive qualification requirements, the FEMC512GBB-E530 delivers proven technology in a compact, surface-mount package. Backed by Flexxon's AXO Series platform, this module provides a solid foundation for automotive and industrial applications requiring robust non-volatile storage with predictable supply and qualification pedigree.
Ready to integrate automotive-qualified eMMC storage into your next design? Request a quote for the FEMC512GBB-E530 today to discuss volume pricing, delivery schedules, and technical support for your application requirements.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015