FEMC512GBG-E530

AXO 5.1 100ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC512GBG-E530 512GB eMMC 5.1 3D TLC

Quantity 1,086 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size4.096 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging100-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization512G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC512GBG-E530 – 512GB Industrial eMMC 5.1 Flash Memory Module

The FEMC512GBG-E530 from Flexxon is a high-capacity 512GB embedded MultiMediaCard (eMMC 5.1) memory solution designed for industrial applications. Built with 3D TLC NAND flash technology and a fully integrated controller compliant with JEDEC eMMC 5.1 standards, this surface-mount module delivers reliable non-volatile storage in a compact 100-ball FBGA package. Engineered to operate across an industrial temperature range of -25°C to 85°C, the FEMC512GBG-E530 provides robust performance for embedded systems requiring substantial storage capacity and long-term data retention.

Part of Flexxon's AXO 5.1 series, this eMMC module offers a proven balance of capacity, performance, and industrial-grade reliability. With support for 200 MHz clock frequency and flexible voltage operation, the FEMC512GBG-E530 addresses the storage demands of industrial computing, edge devices, and connected equipment where space constraints and environmental durability are critical design factors.

Key Features

  • High Storage Capacity
    512GB (4.096 Tbit) of embedded flash memory organized as 512G × 8, providing substantial storage for data logging, firmware, media content, and application data in embedded systems.
  • eMMC 5.1 Interface
    JEDEC-compliant eMMC 5.1 interface with 200 MHz clock frequency delivers efficient data transfer rates through a standardized embedded interface, simplifying integration and ensuring compatibility with common embedded processors and controllers.
  • 3D TLC NAND Technology
    Utilizes three-dimensional triple-level cell (3D TLC) flash memory technology, offering a practical balance between capacity, performance, and cost-effectiveness for industrial storage applications.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, enabling reliable performance in demanding industrial environments, outdoor installations, and applications subject to temperature variations beyond commercial specifications.
  • Flexible Voltage Operation
    Supports dual I/O voltage operation (VCCQ: 1.8V/3.3V) with 3.3V core voltage (VCC), allowing compatibility with diverse system architectures and power supply designs while facilitating mixed-voltage board layouts.
  • Compact Surface-Mount Package
    100-ball FBGA package provides a small footprint for space-constrained designs while offering reliable mechanical mounting and thermal characteristics for industrial PCB assemblies.
  • RoHS Compliant
    Meets RoHS environmental compliance standards, supporting responsible manufacturing practices and global regulatory requirements for electronic components.

Typical Applications

  • Industrial Computing and Embedded Systems
    Provides solid-state storage for industrial PCs, embedded controllers, and edge computing platforms requiring large-capacity, reliable data storage in harsh operating environments.
  • IoT Gateways and Edge Devices
    Enables local data buffering, logging, and storage for Internet of Things gateways and edge processing units that aggregate sensor data, perform analytics, or cache content at the network edge.
  • Digital Signage and Multimedia Systems
    Stores media content, operating systems, and applications for digital signage players, information displays, and multimedia kiosks requiring high-capacity embedded storage.
  • Medical and Healthcare Equipment
    Supports data recording and storage requirements in medical devices and diagnostic equipment where reliable non-volatile memory and industrial operating conditions are essential.
  • Transportation and Vehicle Systems
    Provides rugged storage for transportation equipment, fleet management devices, and vehicle computing systems operating across wide temperature ranges and vibration conditions.

Unique Advantages

  • Fully Integrated Storage Solution:
    Combines NAND flash memory and controller in a single, standardized package, eliminating the need for external flash controller design and reducing system complexity, board space, and BOM costs.
  • Industrial-Grade Reliability:
    Extended temperature qualification and industrial-grade design ensure consistent operation in challenging environments where commercial-grade components may not meet durability requirements.
  • Simplified System Integration:
    JEDEC eMMC 5.1 standardized interface and well-defined electrical characteristics streamline hardware design, reduce time-to-market, and ensure compatibility with established embedded processor ecosystems.
  • Scalable Storage Architecture:
    As part of the AXO series offering capacities from 16GB to 512GB, system designers can select the appropriate storage capacity for specific application requirements while maintaining common footprint and interface compatibility.
  • Reduced System Power Budget:
    Integrated controller and optimized power management reduce overall system power consumption compared to discrete flash memory implementations, supporting energy-efficient embedded designs.
  • Global Standards Compliance:
    RoHS environmental compliance and adherence to JEDEC industry standards facilitate global product deployment and support supply chain transparency.

Why Choose the FEMC512GBG-E530?

The FEMC512GBG-E530 delivers a proven, high-capacity embedded storage solution for industrial applications where reliability, integration, and environmental resilience are paramount. Its combination of 512GB capacity, industrial temperature rating, and standardized eMMC 5.1 interface makes it an excellent choice for embedded systems requiring substantial non-volatile storage without the complexity of external flash controller design. The compact 100-ball FBGA package and flexible voltage operation support space-efficient layouts and diverse system architectures.

For embedded system designers, equipment manufacturers, and industrial OEMs seeking a reliable, standards-based storage solution capable of operating across demanding temperature ranges, the FEMC512GBG-E530 offers a well-integrated, field-proven platform backed by Flexxon's industrial memory expertise.

Ready to integrate high-capacity industrial flash storage into your next embedded design? Request a quote for the FEMC512GBG-E530 today or contact our technical sales team to discuss your specific storage requirements and system architecture.

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