FHND001CVBB

SLC NAND 1GB
Part Description

FHND001CVBB 1Gb SLC NAND

Quantity 1,773 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatFLASHTechnologySLC
Memory Size1 GbitGradeCommercialClock FrequencyN/A
Voltage2.7 ~ 3.6VMemory TypeNon-VolatileOperating Temperature0°C - 70°C
Packaging6.5x8.0mm FBGAMounting MethodSurface MountMemory InterfaceN/A
Memory Organization128M x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FHND001CVBB – 1Gb SLC NAND Flash Memory IC

The FHND001CVBB from Flexxon is a 1-gigabit Single-Level Cell (SLC) NAND flash memory IC designed for embedded systems requiring reliable, non-volatile data storage. Organized as 128M × 8, this surface-mount memory solution operates from a 2.7V to 3.6V supply, making it suitable for a wide range of commercial-grade applications where data integrity and endurance are essential.

SLC NAND technology provides superior reliability and write endurance compared to multi-level cell alternatives, making the FHND001CVBB an ideal choice for industrial controls, network infrastructure, and portable devices that demand consistent performance over extended lifecycles. Its compact 6.5×8.0mm FBGA package enables space-efficient integration in cost-sensitive designs.

Key Features

  • 1-Gigabit SLC NAND Flash
    Delivers high endurance and reliable data retention using Single-Level Cell technology, ensuring each cell stores only one bit for maximum reliability and longer lifespan.
  • 128M × 8 Organization
    Memory architecture provides flexible data access patterns suitable for a variety of embedded applications and firmware storage requirements.
  • 2.7V to 3.6V Operating Range
    Wide supply voltage tolerance simplifies power supply design and enables compatibility with both 3.3V and battery-powered systems.
  • Compact FBGA Package
    6.5×8.0mm fine-pitch ball grid array footprint minimizes PCB space requirements while maintaining robust surface-mount reliability.
  • Commercial Temperature Range
    Operates reliably from 0°C to 70°C, covering the thermal requirements of most commercial and consumer electronics applications.
  • RoHS Compliant
    Meets environmental compliance standards for lead-free manufacturing and global market requirements.

Typical Applications

  • Industrial Control Systems
    Provides reliable firmware storage and data logging in PLCs, motor drives, and process controllers where data integrity over many write cycles is critical.
  • Network Infrastructure Equipment
    Stores boot code, configuration data, and logs in routers, switches, and access points that require dependable non-volatile memory with long operational life.
  • Portable and Handheld Devices
    Offers low-voltage, space-efficient memory for GPS units, medical monitors, and test instruments where compact form factor and battery compatibility are essential.
  • Consumer Electronics
    Enables reliable code and data storage in set-top boxes, digital cameras, and multimedia devices operating in standard indoor environments.

Unique Advantages

  • Superior Endurance with SLC Technology:
    Single-Level Cell architecture provides significantly higher write/erase cycle capability compared to MLC or TLC solutions, extending product lifetime in write-intensive applications.
  • Proven Reliability for Embedded Systems:
    Non-volatile flash technology combined with SLC's inherent data retention characteristics ensures firmware and critical data remain intact through power cycles and extended storage periods.
  • Flexible Voltage Operation:
    The 2.7V to 3.6V supply range accommodates both regulated and battery power sources without requiring additional voltage regulation circuitry, simplifying system design.
  • Space-Efficient Integration:
    The 6.5×8.0mm FBGA package delivers 1-gigabit capacity in a minimal footprint, enabling higher storage density in space-constrained designs.
  • Simplified BOM Management:
    Standard NAND flash interface and surface-mount packaging streamline sourcing, assembly, and inventory management for high-volume manufacturing.
  • Environmental Compliance:
    RoHS-compliant construction ensures your designs meet global environmental regulations without material substitution or redesign.

Why Choose the FHND001CVBB?

The FHND001CVBB delivers the ideal balance of capacity, reliability, and cost-effectiveness for embedded systems requiring 1-gigabit non-volatile storage. Its SLC NAND technology provides the endurance and data integrity that commercial applications demand, while the compact FBGA package and wide voltage range simplify integration into space- and power-constrained designs. Engineers benefit from proven NAND flash architecture that reduces design risk and accelerates time-to-market.

Whether you're developing industrial controllers, network equipment, or portable devices, the FHND001CVBB from Flexxon offers a reliable, standards-compliant memory solution backed by a manufacturer focused on embedded storage technologies. Its commercial temperature rating and RoHS compliance ensure your products meet market requirements while the SLC foundation provides the long-term reliability your customers expect.

Ready to integrate reliable SLC NAND flash memory into your next design? Request a quote for the FHND001CVBB today and discover how this proven memory solution can enhance your product's performance and longevity. Contact our team to discuss your specific application requirements and volume pricing.

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    Headquarters: Singapore


    Employees: 51-200


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