FEMC512GBG-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC512GBG-E540 512GB eMMC 5.1 3D TLC

Quantity 1,017 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size4.096 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization512G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC512GBG-E540 – 512GB Industrial-Grade eMMC 5.1 Embedded Flash Storage

The FEMC512GBG-E540 from Flexxon is a high-capacity 512GB embedded MultiMediaCard (eMMC) 5.1 storage solution built with 3D TLC NAND flash technology. Part of Flexxon's AXO 5.1 153-ball eMMC series, this industrial-grade memory device delivers reliable non-volatile storage in a compact 153-FBGA surface-mount package, designed to meet the demanding requirements of industrial and embedded applications.

With a 200 MHz clock frequency and eMMC 5.1 interface, the FEMC512GBG-E540 offers robust performance for data-intensive embedded systems while operating across an extended temperature range of -25°C to 85°C. Its combination of high capacity, industrial reliability, and proven eMMC interface makes it an ideal storage solution for applications requiring long-term data retention and consistent performance in challenging environments.

Key Features

  • High-Capacity Storage
    512GB (4.096 Tbit) of non-volatile flash memory organized as 512G × 8, providing ample storage for data logging, multimedia content, firmware, operating systems, and application data in embedded systems.
  • 3D TLC NAND Technology
    Built on advanced 3D TLC (Triple-Level Cell) flash architecture, delivering a balanced combination of storage density, cost-effectiveness, and performance for industrial embedded applications.
  • eMMC 5.1 Interface
    Industry-standard eMMC 5.1 interface with 200 MHz clock frequency ensures broad compatibility with modern embedded processors and microcontrollers while simplifying integration and reducing design complexity.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in industrial control systems, transportation equipment, medical devices, and other applications exposed to extended temperature conditions.
  • Flexible Voltage Support
    Supports dual voltage operation with VCCQ at 1.8V/3.3V and VCC at 3.3V, providing compatibility with a wide range of host processors and system power architectures.
  • Compact Surface-Mount Package
    153-ball FBGA package offers a small footprint for space-constrained designs while providing robust mechanical reliability for surface-mount assembly processes.
  • RoHS Compliant
    Meets RoHS environmental compliance standards, supporting green design initiatives and ensuring regulatory conformance for global markets.

Typical Applications

  • Industrial Automation and Control
    Provides reliable embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring data logging, configuration storage, and firmware management in factory automation environments.
  • Medical Equipment
    Serves as embedded storage for patient monitoring systems, diagnostic equipment, and medical imaging devices where data retention, reliability, and compliance with extended operating conditions are critical.
  • Transportation and Fleet Management
    Enables data storage for telematics systems, digital tachographs, fleet management devices, and transportation control systems operating in variable temperature environments.
  • Smart Energy and Infrastructure
    Powers storage requirements in smart meters, grid monitoring equipment, renewable energy controllers, and infrastructure management systems requiring long-term data retention and industrial reliability.
  • Commercial IoT Devices
    Supports edge computing gateways, industrial IoT endpoints, and connected device platforms requiring high-capacity local storage for data buffering, analytics, and offline operation.

Unique Advantages

  • Industrial-Grade Reliability: Extended temperature qualification and industrial-grade components ensure consistent operation in demanding environments where commercial-grade storage solutions may not meet performance or longevity requirements.
  • Simplified Integration: Industry-standard eMMC 5.1 interface eliminates the need for external controllers or complex firmware development, reducing design time, bill of materials costs, and time-to-market for embedded systems.
  • High Storage Density: 512GB capacity in a compact FBGA package maximizes data storage capability while minimizing board space, enabling feature-rich applications without sacrificing system size or adding multiple memory devices.
  • Proven Flash Technology: 3D TLC NAND architecture delivers reliable performance characteristics with established endurance and data retention profiles, providing predictable behavior for system design and qualification.
  • Dual Voltage Flexibility: Support for both 1.8V and 3.3V I/O voltage levels simplifies system power design and ensures compatibility with diverse processor platforms without requiring additional level-shifting circuitry.
  • Long-Term Availability: As part of Flexxon's AXO industrial eMMC series spanning 16GB to 512GB capacities, the product family supports design scalability and long product lifecycle requirements typical of industrial applications.

Why Choose the FEMC512GBG-E540?

The FEMC512GBG-E540 delivers industrial-grade embedded storage performance in a proven, easy-to-integrate package. Its combination of high capacity, extended temperature operation, and standard eMMC 5.1 interface makes it particularly well-suited for industrial, medical, and infrastructure applications where reliability, longevity, and consistent performance are non-negotiable requirements. The 153-ball FBGA package provides an optimal balance of storage density and PCB footprint for space-conscious designs.

Engineers designing systems for industrial environments will appreciate the FEMC512GBG-E540's qualification across the -25°C to 85°C temperature range and its RoHS-compliant construction. The device's standard eMMC interface ensures compatibility with a broad ecosystem of embedded processors while minimizing software and hardware integration effort. For applications requiring scalable storage capacity within a consistent product family, Flexxon's AXO series provides migration paths from 16GB to 512GB, supporting product line evolution and lifecycle management strategies.

Ready to integrate reliable, high-capacity embedded storage into your industrial design? Request a quote for the FEMC512GBG-E540 today to discuss your application requirements, volume pricing, and technical support options.

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