FEMC512GBE-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC512GBE-E540 512GB eMMC 5.1 3D TLC

Quantity 1,223 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size4.096 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization512G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC512GBE-E540 – 512GB Industrial eMMC 5.1 Storage Solution

The FEMC512GBE-E540 is a high-capacity 512GB embedded MultiMediaCard (eMMC) 5.1 storage device from Flexxon's AXO series, engineered to deliver reliable non-volatile flash memory for industrial embedded applications. Built on 3D TLC NAND technology in a compact 153-ball FBGA package, this eMMC module provides a complete managed NAND solution with integrated controller, eliminating the complexity of raw NAND management.

Designed for systems requiring substantial storage with industrial-grade reliability, the FEMC512GBE-E540 operates across an extended temperature range of -25°C to 85°C and supports dual voltage I/O (1.8V/3.3V). With a 200 MHz clock frequency and eMMC 5.1 interface, this storage solution delivers the performance and integration needed for data-intensive industrial, embedded computing, and IoT gateway applications.

Key Features

  • High-Capacity 3D TLC Storage
    512GB (4.096 Tbit) of non-volatile flash memory organized as 512G × 8, providing ample storage for firmware, operating systems, application data, logging, and multimedia content in embedded systems.
  • eMMC 5.1 Managed NAND Interface
    Integrated controller handles wear leveling, bad block management, and error correction, simplifying system design by eliminating the need for external NAND controllers and complex firmware development.
  • 200 MHz Clock Operation
    Supports high-speed data transfer with a 200 MHz clock frequency, enabling responsive system performance for applications requiring fast boot times and efficient data access.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in harsh industrial environments, outdoor installations, transportation systems, and other demanding conditions.
  • Flexible Voltage Support
    Dual voltage I/O operation (VCCQ: 1.8V/3.3V) with 3.3V core supply (VCC), providing compatibility with a wide range of host processors and system architectures while supporting low-power design requirements.
  • Compact Surface-Mount Package
    153-ball FBGA package optimized for space-constrained designs, offering a small footprint for integration into compact embedded systems, edge computing devices, and handheld industrial equipment.
  • RoHS Compliant
    Meets RoHS environmental standards, supporting regulatory compliance for global markets and environmentally responsible product design.

Typical Applications

  • Industrial Automation and Control
    Ideal for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring reliable storage for control software, configuration data, and operational logs in factory automation environments.
  • IoT Gateways and Edge Computing
    Provides substantial local storage for edge analytics devices, IoT gateways, and smart city infrastructure that collect, process, and buffer sensor data before cloud transmission.
  • Transportation and Fleet Management
    Well-suited for vehicle telematics systems, dashcams, fleet tracking devices, and rail signaling equipment that operate across wide temperature ranges and require dependable data storage for trip logs and diagnostic information.
  • Medical and Healthcare Devices
    Supports portable diagnostic equipment, patient monitoring systems, and medical imaging devices requiring high-capacity storage for image data, patient records, and embedded operating systems.
  • Digital Signage and Point-of-Sale
    Enables storage of multimedia content, transaction logs, and operating systems in retail point-of-sale terminals, interactive kiosks, and digital signage players deployed in diverse environmental conditions.

Unique Advantages

  • Managed NAND Simplicity:
    The integrated eMMC controller eliminates complex NAND management tasks from your host processor, reducing firmware development time, simplifying qualification, and accelerating time-to-market for your embedded designs.
  • Industrial-Grade Reliability:
    Extended temperature qualification (-25°C to 85°C) ensures consistent operation in challenging environments where consumer-grade storage solutions would fail, reducing field failures and warranty costs.
  • High Storage Density:
    512GB capacity in a compact FBGA footprint provides the storage headroom needed for feature-rich embedded Linux systems, extensive data logging, and multimedia applications without requiring external storage expansion.
  • Voltage Flexibility:
    Dual I/O voltage support (1.8V/3.3V) simplifies integration with both legacy 3.3V systems and modern low-voltage processor platforms, offering design reuse across product families and reducing bill-of-materials variants.
  • Space-Efficient Integration:
    The 153-ball FBGA surface-mount package minimizes PCB footprint while delivering enterprise-level storage capacity, enabling compact product designs without sacrificing storage performance or reliability.
  • Proven AXO Series Platform:
    Part of Flexxon's AXO 5.1 family (16GB to 512GB), offering a scalable storage roadmap that allows you to optimize capacity across different product tiers while maintaining design consistency and supply chain efficiency.

Why Choose the FEMC512GBE-E540?

The FEMC512GBE-E540 delivers the ideal combination of high storage capacity, industrial reliability, and integration simplicity for demanding embedded applications. By providing 512GB of managed NAND flash in an industrial-temperature-qualified package, this eMMC solution eliminates the complexity and risk associated with raw NAND designs while delivering the performance required for modern data-intensive embedded systems.

For design teams developing industrial equipment, edge computing platforms, or ruggedized embedded systems, the FEMC512GBE-E540 offers a proven storage foundation backed by Flexxon's AXO series architecture. The combination of extended temperature operation, flexible voltage support, and compact packaging makes this eMMC module a reliable choice for applications where storage performance, environmental resilience, and long-term availability are critical to product success.

Ready to integrate reliable, high-capacity storage into your next industrial design? Request a quote for the FEMC512GBE-E540 today and discover how this industrial-grade eMMC solution can simplify your storage architecture while delivering the capacity and reliability your application demands.

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