IS21EF08GP-BCLI

The IS21EF08GP-BCLI is a 64 Gbit non-volatile NAND flash memory device from Integrated Silicon Solution Inc (ISSI), organized as 8G × 8. It implements multi-level cell (MLC) NAND flash technology with an eMMC 5.1 memory interface and is offered in a 153-ball VFBGA package.

This device targets embedded storage and boot applications where a compact, high-density flash solution with a 2.7 V to 3.6 V supply range and a −40°C to 85°C operating range is required.

Key Features

• Memory Type & Capacity 64 Gbit NAND flash, organized as 8G × 8, using MLC technology for non-volatile data storage.
• Interface eMMC_5.1 memory interface for standard embedded storage integration.
• Clock Frequency Supports a 200 MHz clock frequency for memory timing and data transfer operations.
• Voltage Supply Operates from 2.7 V to 3.6 V, enabling use across a range of system power domains.
• Package 153-ball VFBGA package (153-VFBGA, 11.5 × 13 mm) optimized for compact board-level mounting.
• Temperature Range Specified for operation from −40°C to 85°C (TA), suitable for temperature-varied environments.
• Boot Designation Device identifier includes BOOT P, indicating suitability for boot partitioning in system designs.

Typical Applications

• Embedded Systems — Non-volatile mass storage and system boot storage for embedded controllers and single-board computers.
• Industrial Equipment — Persistent data storage in industrial instruments and control units operating within −40°C to 85°C.
• Consumer Electronics — High-density flash storage for consumer devices requiring compact packaging and eMMC interface connectivity.

Unique Advantages

• High-density storage: 64 Gbit capacity in a single 153-ball FBGA package reduces board-level component count for large storage requirements.
• Standard eMMC_5.1 interface: Simplifies integration into existing eMMC-based designs and firmware stacks.
• Wide supply range: 2.7 V to 3.6 V operation supports flexibility across different system power architectures.
• Compact package footprint: 153-VFBGA (11.5 × 13 mm) enables space-constrained designs while maintaining high capacity.
• Industrial temperature support: −40°C to 85°C operating range aligns the device with temperature-varied deployment scenarios.
• Boot-oriented part ID: BOOT P designation for designs that require explicit boot partition support.

Why Choose IS21EF08GP-BCLI?

The IS21EF08GP-BCLI combines high-density MLC NAND flash with an eMMC 5.1 interface in a compact 153-ball VFBGA package, offering a practical storage solution for embedded and industrial applications. Its 2.7 V–3.6 V supply range and −40°C to 85°C operating window provide design flexibility for a variety of system environments.

This device is suited for designers and OEMs requiring integrated boot-capable flash memory with a small board footprint and standardized interface support, backed by ISSI’s product offering.

Request a quote or contact sales to discuss availability, lead times, and technical details for integrating IS21EF08GP-BCLI into your design.