IS21EF08GP-BCLI-TR

8GB, 153 BALL FBGA, 3.3V, BOOT P
Part Description

8GB, 153 BALL FBGA, 3.3V, BOOT P

Quantity 964 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization8G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS21EF08GP-BCLI-TR – 8GB 153-BALL FBGA, 3.3V, BOOT P

The IS21EF08GP-BCLI-TR is a non-volatile NAND Flash memory device organized as 8G × 8 (64 Gbit / 8 GB). It implements MLC NAND Flash technology and provides an eMMC_5.1 compliant memory interface for embedded storage applications.

Designed for systems requiring a compact 153-ball VFBGA package and wide operating conditions, the device supports a 200 MHz clock and a 2.7 V to 3.6 V supply range with an ambient operating temperature range of −40°C to 85°C.

Key Features

  • Memory Core  64 Gbit capacity organized as 8G × 8 for high-density non-volatile storage.
  • Technology  MLC NAND Flash technology providing multi-level cell storage in flash format.
  • Interface  eMMC_5.1 memory interface for standard embedded flash connectivity.
  • Performance  Rated for a 200 MHz clock frequency.
  • Power  Supports a supply voltage range of 2.7 V to 3.6 V (nominal 3.3 V operation indicated in product name).
  • Temperature Range  Operates over an ambient temperature range of −40°C to 85°C (TA).
  • Package  153-ball VFBGA package, dimensions 11.5 × 13 mm, suitable for compact board designs.
  • Memory Format  Non-volatile FLASH memory format with eMMC interface organization.

Typical Applications

  • Systems with eMMC host controllers  Provides eMMC_5.1 compliant embedded storage for devices that integrate standard eMMC hosts.
  • Space-constrained designs  153-VFBGA (11.5 × 13 mm) package enables compact board-level implementation.
  • Industrial and embedded equipment  Specified ambient operating range of −40°C to 85°C supports deployment in a wide range of temperature environments.
  • High-density storage requirements  64 Gbit (8GB) capacity addresses applications needing multi-gigabyte non-volatile storage in an integrated flash solution.

Unique Advantages

  • High storage density: 64 Gbit (8GB) capacity in a single 153-ball VFBGA device reduces system BOM compared to multi-device solutions.
  • Standardized interface: eMMC_5.1 compatibility simplifies integration with eMMC host controllers and firmware stacks that support the standard.
  • Wide voltage tolerance: 2.7 V to 3.6 V supply range accommodates typical 3.3 V system rails and some variation in power domains.
  • Extended temperature operation: −40°C to 85°C ambient range enables use across a broad set of environmental conditions.
  • Compact package: 153-VFBGA (11.5 × 13 mm) package supports dense board layouts where PCB area is limited.

Why Choose 8GB, 153 BALL FBGA, 3.3V, BOOT P?

The IS21EF08GP-BCLI-TR combines MLC NAND Flash density with an eMMC_5.1 interface and a compact 153-VFBGA package, delivering a ready-made embedded storage component for designs that require multi-gigabyte non-volatile memory in constrained form factors. Its 2.7 V–3.6 V supply range, 200 MHz clock rating, and −40°C to 85°C operating range make it suitable for a variety of embedded and industrial applications that mandate defined electrical and thermal specifications.

This device is appropriate for engineers specifying eMMC_5.1 flash memory where capacity, package footprint, and operating range are primary selection criteria.

Request a quote or contact sales to discuss availability, lead times, and pricing for IS21EF08GP-BCLI-TR.

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