IS21EF08GP-JQLI-TR

8GB, 100 BALL FBGA, 3.3V, ROHS,
Part Description

8GB, 100 BALL FBGA, 3.3V, ROHS,

Quantity 1,174 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package100-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization8G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS21EF08GP-JQLI-TR – 8GB (64 Gbit) 100-ball FBGA NAND Flash, eMMC 5.1, 2.7–3.6V

The IS21EF08GP-JQLI-TR is a non-volatile NAND flash memory device from Integrated Silicon Solution Inc. It provides 64 Gbit (organized as 8G × 8) of MLC NAND flash in a 100-ball LFBGA package with an eMMC 5.1 interface.

Designed for embedded storage applications, this device combines high-density flash memory, a 200 MHz clock capability, and a wide supply range to support systems that require compact, board-mounted non-volatile storage across a broad operating temperature range.

Key Features

  • Memory Technology Multi-Level Cell (MLC) NAND flash, offering 64 Gbit capacity organized as 8G × 8 for high-density embedded storage.
  • Interface eMMC 5.1 memory interface for standardized integration into embedded host controllers.
  • Performance 200 MHz clock frequency specification to support timing demands of eMMC-based data transfers.
  • Supply Voltage Operates from 2.7 V to 3.6 V, enabling designs that use standard 3.3 V supply domains.
  • Package 100-ball LFBGA package (100-LBGA / 100-LFBGA, 14 × 18) for compact, surface-mount board implementations.
  • Operating Temperature Specified for −40°C to 85°C (TA), suitable for a wide range of commercial and industrial ambient conditions.

Typical Applications

  • Embedded Storage Provides eMMC 5.1–compatible non-volatile storage for embedded systems requiring up to 64 Gbit of NAND flash.
  • Consumer Electronics Compact LFBGA packaging and eMMC interface support integration into space-constrained consumer devices.
  • Industrial Equipment Wide operating temperature range and robust supply voltage window allow use in industrial controllers and instrumentation.

Unique Advantages

  • High Density in Compact Package: 64 Gbit (8G × 8) capacity in a 100-ball LFBGA footprint reduces PCB area for space-sensitive designs.
  • Standardized eMMC 5.1 Interface: Simplifies host integration and firmware support by using a well-defined eMMC interface.
  • Wide Supply Range: 2.7 V to 3.6 V operation provides design flexibility for systems using 3.3 V power rails.
  • Broad Ambient Temperature: −40°C to 85°C operating range supports deployment in diverse environmental conditions.
  • MLC NAND Capacity: Multi-level cell technology enables higher storage capacity within the given package constraints.

Why Choose IS21EF08GP-JQLI-TR?

The IS21EF08GP-JQLI-TR is positioned as a high-density, board-mount eMMC 5.1 flash memory solution that balances capacity and integration for embedded designs. Its 64 Gbit MLC NAND organization, 100-ball LFBGA package, and 2.7–3.6 V supply range make it suitable for systems that need compact, standardized non-volatile storage across a wide temperature range.

This device is appropriate for engineers and procurement teams developing embedded platforms, consumer devices, or industrial equipment that require certified form-factor memory with eMMC connectivity and predictable electrical and thermal specifications from Integrated Silicon Solution Inc.

Request a quote or submit an inquiry to obtain pricing and availability for IS21EF08GP-JQLI-TR.

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