IS21EF08GP-JCLI-TR

The IS21EF08GP-JCLI-TR is a non-volatile NAND flash memory device organized as 8G × 8 (64 Gbit / 8GB) with an eMMC 5.1 memory interface. It implements multi-level cell (MLC) NAND technology and is offered in a 153-ball VFBGA package.

Designed for embedded storage applications requiring a high-density NAND solution, the device provides a 200 MHz clock frequency, a 2.7 V–3.6 V supply range, and an operating temperature range of −40°C to 85°C.

Key Features

• Memory Type & Organization  Non-volatile NAND flash using MLC technology, organized as 8G × 8 for a total of 64 Gbit (8GB).
• Interface & Performance  Supports an eMMC 5.1 memory interface with an indicated clock frequency of 200 MHz.
• Voltage Supply  Operates from 2.7 V to 3.6 V, accommodating common 3.3 V system rails.
• Operating Temperature  Rated for −40°C to 85°C ambient (TA), suitable for a wide range of temperature environments.
• Package  153‑ball VFBGA package (11.5 × 13 mm), surface-mount supplier device package 153‑VFBGA.
• Memory Format  FLASH NAND memory formatted for embedded storage use; mounting and packaging optimized for board-level integration.

Unique Advantages

• High density storage: 64 Gbit (8G × 8) capacity provides substantial embedded Flash storage within a single device.
• Standard eMMC interface: eMMC 5.1 interface simplifies integration into systems designed for embedded memory controllers.
• Wide supply range: 2.7 V–3.6 V operation supports compatibility with common 3.3 V supply domains.
• Extended temperature support: −40°C to 85°C operating range enables use across varied environmental conditions.
• Compact BGA footprint: 153‑VFBGA (11.5 × 13 mm) package provides a small board area impact for high-density storage implementations.
• Defined clock capability: 200 MHz clock frequency specification supports application designs targeting that performance point.

Why Choose IS21EF08GP-JCLI-TR?

The IS21EF08GP-JCLI-TR combines high-density MLC NAND flash with an eMMC 5.1 interface in a compact 153‑VFBGA package, offering a straightforward path to embedded storage integration. Its electrical and thermal specifications—including a 2.7 V–3.6 V supply range and −40°C to 85°C operating window—make it suitable for designs requiring robust, board-mounted non-volatile memory.

This device is well suited to projects that require a verified, high-capacity NAND solution with defined electrical characteristics and a standard memory interface, providing long-term value through predictable integration and clear device-level specifications.

Request a quote or contact sales to discuss availability, pricing, and suitability for your design.