IS22EF08GP-JCLA2-TR
| Part Description |
8GB, 153 BALL FBGA, 3.3V, ROHS, |
|---|---|
| Quantity | 832 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of IS22EF08GP-JCLA2-TR – 8GB eMMC 5.1 NAND Flash, 153-ball VFBGA
The IS22EF08GP-JCLA2-TR is a 64 Gbit (8GB) non-volatile NAND flash memory device with an eMMC_5.1 memory interface. It implements MLC NAND flash technology in a compact 153-ball VFBGA package for applications that require high-density embedded storage.
Designed for demanding environments, the device supports a wide operating temperature range and AEC-Q100 qualification, positioning it for automotive and other temperature-sensitive system applications that require reliable, high-capacity flash storage with a standard eMMC interface.
Key Features
- Memory Type & Technology Non-volatile NAND Flash using MLC (multi-level cell) technology, organized as 8G × 8 for a total memory size of 64 Gbit (8GB).
- Interface eMMC_5.1 memory interface for standard embedded storage connectivity in host systems expecting eMMC 5.1 devices.
- Performance Supports a clock frequency up to 200 MHz as specified.
- Voltage Supply Operates across a 2.7 V to 3.6 V supply range with a nominal 3.3 V condition listed in the product name.
- Package 153-ball VFBGA package (11.5 × 13 mm) providing a small footprint for high-density board-level integration.
- Temperature & Qualification Rated for operation from –40°C to 105°C (TA) and qualified to AEC-Q100 for automotive-grade reliability.
Typical Applications
- Automotive Systems Automotive infotainment, telematics, and other in-vehicle storage applications where AEC-Q100 qualification and an extended temperature range are required.
- Embedded eMMC Storage General embedded systems that require a standard eMMC_5.1 interface and high-density non-volatile storage.
- Industrial & Harsh-Environment Electronics Systems operating across a wide temperature range (–40°C to 105°C) that need reliable NAND flash storage in a compact package.
Unique Advantages
- High-density 64 Gbit capacity: Provides 8GB of non-volatile storage in a single-device solution to support large firmware, data logging, or multimedia content.
- Standard eMMC_5.1 interface: Enables integration into designs that require an eMMC host interface for streamlined system connectivity.
- Automotive-grade qualification: AEC-Q100 qualification supports use in automotive designs requiring component-level automotive qualification.
- Wide operating temperature range: –40°C to 105°C rating supports deployment in temperature-challenging environments.
- Compact VFBGA package: 153-ball (11.5 × 13 mm) VFBGA package delivers a small board footprint for space-constrained designs.
- Flexible supply range: Operates from 2.7 V to 3.6 V, accommodating common 3.3 V system rails.
Why Choose IS22EF08GP-JCLA2-TR?
The IS22EF08GP-JCLA2-TR combines high-density MLC NAND flash storage with a standard eMMC_5.1 interface and an automotive-qualified design. Its combination of 64 Gbit capacity, wide supply voltage range, extended temperature rating, and compact 153-ball VFBGA package makes it well suited to embedded systems and automotive applications that require robust, high-capacity non-volatile storage.
This device is appropriate for engineers and procurement teams designing systems that demand verified temperature performance and AEC-Q100 qualification while maintaining a small board footprint and standard eMMC connectivity.
Request a quote or contact sales to discuss availability, pricing, and technical details for the IS22EF08GP-JCLA2-TR.