IS22EF08GP-JQLA2

8GB, 100 BALL FBGA, 3.3V, ROHS,
Part Description

8GB, 100 BALL FBGA, 3.3V, ROHS,

Quantity 618 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package100-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCN3A991B1AHTS Code8542.32.0071

Overview of IS22EF08GP-JQLA2 - 8GB eMMC 5.1 Automotive NAND Flash Memory

The IS22EF08GP-JQLA2 is an 8GB embedded MultiMediaCard (eMMC) 5.1 NAND flash memory designed for automotive applications requiring reliable non-volatile storage. Based on multi-level cell (MLC) NAND technology organized as 8G x 8, this automotive-grade memory delivers high-density storage with eMMC 5.1 interface compatibility for streamlined integration into embedded systems. AEC-Q100 qualified and rated for -40°C to 105°C operation, this device provides dependable data retention for demanding automotive environments.

Key Features

  • 8GB Non-Volatile Storage - MLC NAND flash technology provides 64 Gbit (8 gigabytes) of embedded storage organized as 8G x 8, suitable for firmware, operating systems, data logging, and multimedia content in automotive systems.
  • eMMC 5.1 Interface - Industry-standard embedded MultiMediaCard interface with 200 MHz clock frequency simplifies integration and provides backward compatibility with existing eMMC host controllers.
  • Automotive Qualification - AEC-Q100 qualified for automotive electronics with extended temperature range (-40°C to 105°C) ensuring reliable operation in engine compartments, under-hood applications, and harsh vehicular environments.
  • Flexible Power Supply - Operates from 2.7V to 3.6V supply voltage, compatible with standard 3.3V and battery-powered automotive electrical systems.
  • Compact 100-LFBGA Package - Low-profile 100-ball Fine-pitch Ball Grid Array in 14mm x 18mm footprint minimizes PCB space requirements for space-constrained automotive module designs.

Typical Applications

  • Automotive Infotainment Systems - This eMMC provides embedded storage for multimedia content, navigation maps, and operating systems in head units and display controllers where the eMMC 5.1 interface enables fast boot times and reliable media playback.
  • Advanced Driver Assistance Systems (ADAS) - The automotive-qualified memory stores calibration data, software algorithms, and event logs for camera systems and sensor fusion modules where AEC-Q100 qualification ensures dependable operation across temperature extremes.
  • Telematics and Connectivity Modules - This device supports firmware storage and data buffering in connected vehicle gateways and telematics control units where the extended temperature range maintains data integrity in under-hood installations.
  • Digital Instrument Clusters - The 8GB capacity accommodates graphics assets, fonts, and configuration data for reconfigurable digital displays where the compact LFBGA package fits within tight instrument panel space constraints.
  • Electronic Control Units (ECUs) - This flash memory provides non-volatile storage for control software and diagnostic data in powertrain, chassis, and body control modules where automotive qualification meets stringent reliability requirements.

Unique Advantages

  • Simplified BOM with Integrated Controller: The eMMC architecture includes an integrated flash controller that handles error correction, wear leveling, and bad block management, reducing host processor overhead and simplifying system design compared to raw NAND implementations.
  • Proven Automotive Reliability: AEC-Q100 qualification demonstrates compliance with automotive stress testing requirements, reducing qualification time for automotive OEMs and Tier 1 suppliers integrating this component.
  • Extended Temperature Performance: The -40°C to 105°C operating range enables placement in thermally challenging locations such as engine compartments or behind dashboards without requiring additional thermal management.
  • Design Flexibility: The 2.7V to 3.6V supply voltage range accommodates both regulated 3.3V rails and direct battery connections, simplifying power supply design in automotive modules.
  • Space-Efficient Footprint: The 100-ball LFBGA package in a 14mm x 18mm form factor provides high pin density while maintaining compatibility with standard PCB manufacturing processes for automotive applications.
  • Industry-Standard Interface: eMMC 5.1 compatibility ensures broad host controller support and provides a migration path for future capacity expansions without requiring interface redesign.

Why Choose IS22EF08GP-JQLA2?

The IS22EF08GP-JQLA2 is positioned for automotive system designers who require automotive-qualified embedded storage with proven reliability and streamlined integration. With AEC-Q100 qualification, extended temperature performance, and the simplified integration benefits of the eMMC 5.1 standard, this device addresses the demanding requirements of next-generation automotive electronics from infotainment and ADAS to telematics and instrument clusters.

By combining 8GB of MLC NAND storage with an integrated controller and automotive-grade qualification, this component reduces development complexity while meeting the stringent quality and reliability expectations of automotive applications. The compact LFBGA package and flexible voltage range further enhance design flexibility for space-constrained automotive modules.

Get Started with IS22EF08GP-JQLA2

To discuss how the IS22EF08GP-JQLA2 can meet your automotive embedded storage requirements, request a quote or contact our sales team for technical support, samples, and volume pricing information.

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