IS22TF64G-JQLA1-TR

The IS22TF64G-JQLA1-TR is a 512 Gbit non-volatile NAND FLASH device using TLC technology, organized as 64G × 8 and presented in an eMMC 5.1 memory interface. It provides high-density embedded storage with a 200 MHz clock frequency for applications that require compact, integrated flash memory.

With AEC-Q100 qualification and an automotive grade listing, this device targets automotive and embedded system designs that demand proven reliability across an operating temperature range of −40°C to 85°C. It is supplied in a 100-LFBGA (14×18) package and supports a 2.7 V to 3.6 V power range.

Key Features

• Memory Technology 512 Gbit NAND FLASH using TLC technology, provided as non-volatile memory for persistent storage.
• Memory Organization Organized as 64G × 8 to deliver the specified 512 Gbit capacity in an eMMC form factor.
• Interface eMMC 5.1 memory interface for standardized embedded memory integration.
• Performance Supports a clock frequency of 200 MHz to meet timing requirements of embedded storage subsystems.
• Power Wide supply voltage range of 2.7 V to 3.6 V to accommodate common system power rails.
• Package Supplied in a 100-LFBGA package (14×18) enabling a compact board footprint.
• Temperature & Qualification Operates across −40°C to 85°C (TA) and carries AEC-Q100 qualification for automotive-grade applications.

Typical Applications

• Automotive systems — High-density embedded storage for control units and other automotive electronics that require qualified non-volatile memory.
• Embedded storage modules — eMMC 5.1 interface and 512 Gbit capacity for systems needing integrated flash memory.
• Industrial embedded devices — Reliable non-volatile storage across a wide temperature range for industrial applications.

Unique Advantages

• High-density storage: 512 Gbit capacity (64G × 8) provides substantial on-board non-volatile memory in a single device.
• Automotive-qualified: AEC-Q100 qualification and automotive grade designation support use in safety- and reliability-focused designs.
• Standardized interface: eMMC 5.1 connectivity simplifies integration into systems designed for eMMC storage.
• Wide operating range: −40°C to 85°C operating temperature supports deployment in demanding thermal environments.
• Flexible power supply: 2.7 V to 3.6 V operation for compatibility with common system power rails.
• Compact package: 100-LFBGA (14×18) package reduces PCB area while delivering large storage capacity.

Why Choose IS22TF64G-JQLA1-TR?

The IS22TF64G-JQLA1-TR combines high-density TLC NAND flash with an eMMC 5.1 interface and automotive AEC-Q100 qualification, delivering a balance of capacity, integration, and reliability for embedded and automotive designs. Its 200 MHz clock support, wide supply voltage range, and −40°C to 85°C operating range make it suitable for systems that require robust, persistent storage in a compact package.

This part is appropriate for designers specifying large-capacity non-volatile memory where standardized eMMC connectivity and automotive qualification are important selection criteria. The combination of capacity, package, and qualification supports long-term deployment in qualified embedded applications.

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