IS22TF64G-JCLA1-TR

The IS22TF64G-JCLA1-TR is a 512 Gbit non-volatile NAND Flash memory device in an eMMC 5.1 format. Implemented with TLC NAND technology and organized as 64G × 8, it delivers high-density onboard storage in a compact 153‑VFBGA package for space-constrained embedded and automotive applications.

Built to automotive-grade specifications with AEC‑Q100 qualification, the device targets designs that require large-capacity, soldered eMMC storage with defined electrical and thermal operating ranges.

Key Features

• Memory Type & Technology 512 Gbit non-volatile NAND Flash using TLC (Triple-Level Cell) technology, organized as 64G × 8 for high density storage.
• Interface eMMC 5.1 memory interface for integrated embedded storage in host designs.
• Performance 200 MHz clock frequency specification for the device interface timing.
• Power Wide supply voltage range from 2.7 V to 3.6 V to support standard embedded power rails.
• Reliability & Qualification AEC‑Q100 qualification and Automotive grade designation indicate suitability for automotive development workflows.
• Package & Form Factor 153‑VFBGA package (11.5 × 13 mm) offering a compact, soldered footprint for board-level integration.
• Operating Temperature Specified operating range of −40°C to 85°C (TA) to support extended-temperature applications.

Typical Applications

• Automotive Systems Onboard mass storage in automotive electronic control and infotainment systems where AEC‑Q100 qualification is required.
• Embedded Storage High-density eMMC storage for embedded systems and single-board computers requiring soldered non-volatile memory.
• Industrial Electronics Storage for industrial controllers and devices that operate across the specified −40°C to 85°C temperature range.

Unique Advantages

• High Density Onboard Storage: 512 Gbit capacity delivered in a single-package eMMC solution to reduce external memory count and BOM complexity.
• Automotive-Grade Qualification: AEC‑Q100 qualification and Automotive grade designation support integration into automotive designs with defined qualification expectations.
• Standard eMMC Interface: eMMC 5.1 interface enables straightforward integration into hosts designed for embedded eMMC storage.
• Compact Footprint: 153‑VFBGA (11.5 × 13 mm) package minimizes board area for space-constrained applications.
• Wide Supply Voltage: 2.7 V to 3.6 V operation aligns with common system power rails, simplifying power supply design.
• Extended Operating Temperature: −40°C to 85°C rating supports designs that require reliable operation across commercial and industrial temperature ranges.

Why Choose IS22TF64G-JCLA1-TR?

The IS22TF64G-JCLA1-TR positions itself as a high-density, automotive-grade eMMC storage component combining a TLC NAND architecture with a standard eMMC 5.1 interface. Its 512 Gbit capacity, AEC‑Q100 qualification, and compact 153‑VFBGA package make it suitable for designers who need soldered, large-capacity non-volatile storage within defined electrical and thermal envelopes.

This device is suited to teams developing embedded, industrial, or automotive systems that prioritize integrated storage density, a standard host interface, and operation across −40°C to 85°C. The combination of qualification, voltage flexibility, and package size supports long-term deployment and simplified system integration.

Request a quote or submit a pricing inquiry to evaluate IS22TF64G-JCLA1-TR availability and lead times for your design requirements.