IS22TF64G-JCLA2-TR
| Part Description |
IC FLASH 512GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 655 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of IS22TF64G-JCLA2-TR – IC FLASH 512Gbit eMMC 153-VFBGA
The IS22TF64G-JCLA2-TR is a 512 Gbit non-volatile NAND flash device in an eMMC form factor. It implements TLC NAND flash memory with an eMMC 5.1 interface and a 64G × 8 memory organization to provide high-density embedded storage.
Designed for embedded systems and automotive-grade applications, the device combines a 200 MHz clock capability, a 2.7 V–3.6 V supply range, and AEC-Q100 qualification to address designs requiring high-capacity, qualified flash in a compact 153‑VFBGA (11.5 × 13 mm) package.
Key Features
- Memory 512 Gbit NAND flash memory using TLC technology organized as 64G × 8 for high-density embedded storage.
- Interface eMMC 5.1 memory interface for standardized embedded MMC connectivity.
- Performance Supports a 200 MHz clock frequency for eMMC operation.
- Power Operates from a 2.7 V to 3.6 V supply range suitable for common embedded system power rails.
- Reliability & Qualification AEC-Q100 qualification and an operating temperature range of −40 °C to 105 °C (TA) for temperature- and qualification-sensitive designs.
- Package 153-VFBGA package (11.5 × 13 mm) providing a compact, high-pin-density footprint for board-level integration.
Typical Applications
- Automotive systems — Storage for infotainment, telematics, and other automotive electronics where AEC-Q100 qualification and extended temperature range are required.
- Embedded storage — High-capacity eMMC storage for embedded controllers and single-board computers that require large non-volatile memory.
- Industrial equipment — Non-volatile data storage in temperature-sensitive industrial environments benefitting from the device's extended operating range.
Unique Advantages
- High native capacity: 512 Gbit TLC NAND provides large on-board storage for data-heavy embedded applications.
- Standardized interface: eMMC 5.1 simplifies host integration and firmware support for embedded systems.
- Automotive-qualified: AEC-Q100 qualification supports use in automotive designs requiring component-level qualification.
- Wide operating range: −40 °C to 105 °C operation enables deployment across harsh temperature environments.
- Compact package: 153‑VFBGA (11.5 × 13 mm) reduces board area for space-constrained designs.
- Flexible supply range: 2.7 V–3.6 V compatibility with common embedded power domains.
Why Choose IS22TF64G-JCLA2-TR?
The IS22TF64G-JCLA2-TR positions high-density NAND storage and a standardized eMMC 5.1 interface within an automotive-qualified component package. Its combination of 512 Gbit capacity, 200 MHz clock support, wide supply voltage range, and AEC-Q100 qualification make it suitable for designs that require both large embedded storage and qualification for demanding environments.
Manufactured by Integrated Silicon Solution Inc., this device fits design teams targeting compact, qualified storage solutions for automotive and embedded applications where verified temperature performance and a compact VFBGA footprint are important considerations.
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