IS22TF64G-JCLA1
| Part Description |
IC FLASH 512GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 875 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS22TF64G-JCLA1 – IC FLASH 512GBIT EMMC 153VFBGA
The IS22TF64G-JCLA1 is a 512 Gbit non-volatile NAND flash memory device implemented as TLC NAND with an eMMC 5.1 interface. It provides high-density embedded storage in a compact 153-VFBGA package for designs that require robust, onboard flash memory.
Targeted at applications demanding high capacity and reliable operation, the device combines a 64G × 8 memory organization with a 200 MHz clock capability, AEC-Q100 qualification, and a wide operating range for voltage and temperature.
Key Features
- Memory Technology NAND flash (TLC) non-volatile memory delivering 512 Gbit capacity in a 64G × 8 organization.
- Interface eMMC 5.1 memory interface for standard embedded storage connectivity.
- Performance Supports a 200 MHz clock frequency for host interface timing and data transfer operations.
- Electrical Wide supply voltage range from 2.7 V to 3.6 V to accommodate common embedded system power rails.
- Temperature and Qualification Operating temperature range of −40 °C to 85 °C and AEC-Q100 qualification for automotive-grade reliability.
- Package Supplied in a 153-VFBGA package (11.5 × 13 mm) for space-constrained board layouts.
Typical Applications
- Automotive systems High-density embedded storage for systems requiring AEC-Q100-qualified components.
- Industrial equipment Non-volatile memory for controllers and data-logging devices operating across −40 °C to 85 °C.
- Embedded storage Large-capacity onboard flash for devices needing compact, high-density eMMC 5.1 storage.
Unique Advantages
- 512 Gbit high-density storage: Enables large-capacity data retention and local storage without external memory arrays.
- Standard eMMC 5.1 interface: Simplifies integration with host processors supporting common eMMC protocols.
- AEC-Q100 qualified: Provides component-level qualification suitable for automotive-grade designs.
- Wide operating conditions: −40 °C to 85 °C temperature rating and 2.7 V–3.6 V supply tolerance for robust operation in diverse environments.
- Compact VFBGA package: 153-VFBGA (11.5 × 13 mm) reduces board area while delivering large memory capacity.
Why Choose IS22TF64G-JCLA1?
The IS22TF64G-JCLA1 positions itself as a compact, high-capacity eMMC flash solution for designs that require automotive-grade qualification, wide temperature operation, and standard eMMC 5.1 connectivity. Its combination of 512 Gbit TLC NAND, AEC-Q100 qualification, and a small 153-VFBGA footprint makes it suitable for engineers specifying reliable, embedded storage where space and environmental robustness are important.
For projects that demand standardized interface compatibility and high-density local storage, this device offers a straightforward integration path while meeting voltage and temperature constraints typical of demanding embedded and automotive applications.
Request a quote or contact sales to discuss availability, pricing, and lead-time options for IS22TF64G-JCLA1.
