IS22TF32G-JCLA2-TR

IC FLASH 256GBIT EMMC 153VFBGA
Part Description

IC FLASH 256GBIT EMMC 153VFBGA

Quantity 469 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of IS22TF32G-JCLA2-TR – IC FLASH 256GBIT EMMC 153VFBGA

The IS22TF32G-JCLA2-TR is a 256 Gbit non-volatile NAND flash memory device in an eMMC form factor. It implements TLC NAND technology with a 32G × 8 organization and an eMMC 5.1 interface for embedded mass storage.

Designed for applications requiring high-density, board-mounted flash in a compact VFBGA package, this device offers an automotive-grade qualification (AEC-Q100), a wide operating temperature range, and a nominal supply range to suit embedded and vehicle electronics environments.

Key Features

  • Memory Type & Technology 256 Gbit NAND flash using TLC technology in a 32G × 8 memory organization for high-density non-volatile storage.
  • Interface Compliant with the eMMC 5.1 memory interface for standard embedded storage integration.
  • Performance Operates with a clock frequency specification of 200 MHz to support the device interface timing.
  • Package 153‑VFBGA package (11.5 × 13 mm) providing a compact board footprint for space-constrained designs.
  • Power Supply voltage range of 2.7 V to 3.6 V suitable for common embedded power rails.
  • Reliability & Qualification AEC‑Q100 qualification and an operating temperature range of −40 °C to 105 °C for automotive-grade deployments.
  • Memory Format Non-volatile FLASH memory format suitable for persistent data and program storage.

Typical Applications

  • Automotive embedded storage — eMMC 5.1 flash for vehicle systems where AEC‑Q100 qualification and wide temperature range are required.
  • Infotainment and telematics — compact, board-mounted mass storage for media, firmware, and system data.
  • Board-level embedded systems — on-board non-volatile storage for controllers and modules needing 256 Gbit capacity in a small package.

Unique Advantages

  • Automotive-qualified component: AEC‑Q100 qualification combined with −40 °C to 105 °C operating range supports use in vehicle electronics.
  • High-density storage: 256 Gbit capacity in a single device enables large firmware, data logging, and media storage without multi-chip solutions.
  • Standard eMMC interface: eMMC 5.1 compatibility simplifies integration with existing controller ecosystems.
  • Compact VFBGA package: 153‑VFBGA (11.5 × 13 mm) reduces PCB area for space-constrained designs.
  • Flexible power range: 2.7 V to 3.6 V supply allows operation from common embedded power rails.
  • TLC NAND technology: Provides a balance of storage density and cost efficiency for mass data storage needs.

Why Choose IC FLASH 256GBIT EMMC 153VFBGA?

The IS22TF32G-JCLA2-TR combines high-density TLC NAND flash, an industry-standard eMMC 5.1 interface, and automotive-grade qualification to deliver a compact, board-mounted storage solution. Its electrical and environmental specifications make it suitable for embedded systems that require persistent large-capacity memory in constrained footprints.

This device is well suited to design teams and procurement looking for a single-chip 256 Gbit eMMC solution with defined operating and qualification characteristics, supporting long-term deployment in automotive and embedded applications.

Request a quote or contact sales to discuss availability, lead times, and how the IS22TF32G-JCLA2-TR can fit into your next embedded or automotive design.

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