IS22TF32G-JCLA1

IC FLASH 256GBIT EMMC 153VFBGA
Part Description

IC FLASH 256GBIT EMMC 153VFBGA

Quantity 1,485 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of IS22TF32G-JCLA1 – IC FLASH 256Gbit eMMC 153-VFBGA

The IS22TF32G-JCLA1 is a 256 Gbit non-volatile NAND flash memory device implemented as TLC NAND with an integrated eMMC 5.1 interface. It combines high-density flash storage with a standard embedded memory interface and an automotive-grade qualification.

Designed for embedded storage applications that require compact packaging, wide temperature operation, and system-level reliability, this device supports a 200 MHz clock and operates from a 2.7 V to 3.6 V supply.

Key Features

  • Memory Type 256 Gbit non-volatile NAND flash (TLC), organized as 32G × 8 for high-density local storage.
  • Interface Integrated eMMC 5.1 memory interface for standard embedded system connectivity.
  • Performance Supports a 200 MHz clock frequency to align with system timing requirements.
  • Voltage Flexible supply range: 2.7 V to 3.6 V to suit common embedded power domains.
  • Qualification & Grade AEC-Q100 qualified and specified as Automotive grade for designs requiring automotive-level qualification.
  • Package 153-pin VFBGA package (11.5 × 13 mm) enabling a compact board footprint.
  • Temperature Range Operating temperature range of −40°C to 85°C (TA) for use in a wide range of environmental conditions.

Typical Applications

  • Automotive systems Storage for control modules, infotainment, or other automotive electronics where AEC-Q100 qualification and automotive grade components are required.
  • Embedded systems Onboard non-volatile storage for embedded devices that require an eMMC 5.1 interface and high-density NAND memory.
  • Industrial equipment Local flash storage in systems operating across −40°C to 85°C and requiring robust packaging and voltage flexibility.

Unique Advantages

  • High-density storage: 256 Gbit capacity provides substantial local storage while maintaining a compact package footprint.
  • Standard eMMC 5.1 interface: Simplifies integration into embedded designs using a widely adopted memory interface.
  • Automotive-qualified reliability: AEC-Q100 qualification and Automotive grade designation support use in safety-conscious and vehicle applications.
  • Wide operating range: −40°C to 85°C rating and 2.7 V–3.6 V supply support deployment in varied thermal and power environments.
  • Compact package: 153-VFBGA (11.5 × 13 mm) allows dense PCB layouts while providing required pinout and connectivity.

Why Choose IS22TF32G-JCLA1?

The IS22TF32G-JCLA1 positions itself as a high-density, automotive-qualified eMMC flash device that addresses embedded storage needs where reliability, temperature range, and standard interface compatibility matter. Its combination of 256 Gbit TLC NAND, eMMC 5.1 interface, and AEC-Q100 qualification makes it suitable for designers targeting automotive and other demanding embedded applications.

This device is appropriate for projects needing a balance of capacity, compact packaging, and supply-voltage flexibility, providing a stable storage option backed by clear electrical and environmental specifications.

Request a quote or contact sales to discuss pricing, availability, and support for integrating the IS22TF32G-JCLA1 into your design.

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