IS22TF08G-JQLA1
| Part Description |
IC FLASH 64GBIT EMMC 100LFBGA |
|---|---|
| Quantity | 1,763 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (pSLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of IS22TF08G-JQLA1 – IC FLASH 64GBIT EMMC 100LFBGA
The IS22TF08G-JQLA1 is a 64 Gbit non-volatile FLASH memory device employing NAND (pSLC) technology with an 8G × 8 memory organization. It implements an eMMC 5.1 memory interface and is supplied in a 100-LFBGA (14 × 18 mm) package.
Designed for applications requiring a high-density embedded flash solution, the device offers a 200 MHz clock frequency, a 2.7 V to 3.6 V supply range, and an operating temperature range of −40 °C to 85 °C. The part is AEC-Q100 qualified and classified as Automotive grade.
Key Features
- Memory Core 64 Gbit capacity implemented as 8G × 8 using FLASH - NAND (pSLC) technology.
- Interface eMMC_5.1 memory interface for host connectivity and standard embedded storage integration.
- Performance Operates with a 200 MHz clock frequency as specified.
- Power Single supply voltage range: 2.7 V to 3.6 V.
- Reliability & Qualification AEC-Q100 qualified and designated as Automotive grade.
- Package 100-LFBGA package (14 × 18 mm) for board-level placement.
- Operating Range Temperature range −40 °C to 85 °C (TA).
Typical Applications
- Automotive Systems Use in automotive electronic modules where AEC-Q100 qualification and the specified temperature range are required.
- Embedded Storage Solutions Local solid-state storage for embedded designs using the eMMC 5.1 interface.
- Industrial Equipment Non-volatile data and firmware storage in control and instrumentation equipment operating within the listed temperature and voltage ranges.
- System Boot and Firmware Storage Storage of system firmware and boot images in designs that require a 64 Gbit eMMC device.
Unique Advantages
- Automotive-Grade Qualification: AEC-Q100 qualification and an Automotive grade classification support use in temperature and reliability-demanding environments.
- Large Capacity in Compact Package: 64 Gbit density packaged in a 100-LFBGA (14 × 18 mm) footprint for space-constrained boards.
- Standard eMMC 5.1 Interface: eMMC_5.1 provides a widely recognized host interface for embedded storage integration.
- pSLC NAND Technology: FLASH - NAND (pSLC) implementation with 8G × 8 organization delivers the specified non-volatile storage configuration.
- Broad Operating Range: Operation from −40 °C to 85 °C and a 2.7 V to 3.6 V supply window enable deployment across a range of embedded environments.
Why Choose IS22TF08G-JQLA1?
The IS22TF08G-JQLA1 offers a 64 Gbit eMMC 5.1 FLASH solution from Integrated Silicon Solution Inc. with automotive-level qualification (AEC-Q100), a 200 MHz clock frequency, and support for a wide operating temperature and voltage range. Its 100-LFBGA package and 8G × 8 memory organization provide a compact, high-density option for embedded storage implementations.
This device is suitable for designs that require a standardized eMMC interface, automotive qualification, and a defined operating envelope for reliable non-volatile storage.
Request a quote or contact sales to discuss availability, pricing, and technical details for the IS22TF08G-JQLA1.
