IS22TF08G-JCLA2-TR

The IS22TF08G-JCLA2-TR is a 64 Gbit non-volatile NAND flash memory device in an eMMC 5.1 memory format, manufactured by Integrated Silicon Solution Inc (ISSI). It uses pSLC NAND technology organized as 8G × 8 to provide high-density embedded storage.

Designed for systems that require an integrated eMMC interface and robust environmental tolerance, this device offers a 200 MHz clock frequency, a 2.7 V–3.6 V supply range, AEC‑Q100 qualification and an operating temperature range from −40 °C to 105 °C in a compact 153‑VFBGA (11.5 × 13 mm) package.

Key Features

• Memory Type & Organization  Non-volatile NAND flash (pSLC) organized as 8G × 8 for a total memory size of 64 Gbit.
• Memory Interface  eMMC 5.1 interface for host integration using standard eMMC protocols.
• Performance  200 MHz clock frequency for memory operation timing.
• Voltage Supply  Operates from 2.7 V to 3.6 V to match common system power rails.
• Temperature & Qualification  Operating ambient range of −40 °C to 105 °C (TA) and AEC‑Q100 qualification for automotive-grade applications.
• Package & Mechanical  153‑VFBGA package with a footprint of 11.5 × 13 mm, suitable for surface-mount PCB integration.

Typical Applications

• Automotive Systems  Non-volatile storage for automotive electronic control units and infotainment devices that require AEC‑Q100 qualified components and wide operating temperatures.
• Embedded Storage  On-board eMMC 5.1 storage for embedded processors and single-board computers in compact systems.
• Industrial Equipment  Flash memory for industrial controllers and instrumentation operating across −40 °C to 105 °C.

Unique Advantages

• AEC‑Q100 Qualified: AEC‑Q100 qualification supports integration into automotive-grade designs that require recognized component qualification.
• High Density 64 Gbit Capacity: 8G × 8 organization delivers substantial non-volatile storage capacity in a single device.
• Standard eMMC 5.1 Interface: eMMC 5.1 simplifies host integration and firmware interaction for embedded systems.
• Wide Temperature Range: −40 °C to 105 °C operation supports deployment in harsh thermal environments.
• Flexible Power Range: 2.7 V–3.6 V supply compatibility with common system rails eases power design.
• Compact BGA Package: 153‑VFBGA (11.5 × 13 mm) minimizes PCB footprint for space-constrained designs.

Why Choose IS22TF08G-JCLA2-TR?

The IS22TF08G-JCLA2-TR combines a 64 Gbit pSLC NAND architecture with an eMMC 5.1 interface and automotive-grade qualification, positioning it for embedded and automotive applications that require high-density non-volatile storage and robust environmental performance. Its electrical and mechanical specifications—200 MHz clocking, 2.7 V–3.6 V supply, and a compact 153‑VFBGA package—support integration into a range of system designs.

Manufactured by Integrated Silicon Solution Inc (ISSI), this part is suitable for engineers specifying validated flash memory for designs requiring wide temperature operation and recognized qualification status, helping to reduce integration uncertainty in demanding applications.

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