IS22TF32G-JCLA1-TR

The IS22TF32G-JCLA1-TR is a 256 Gbit non-volatile NAND flash memory device supplied by Integrated Silicon Solution Inc. It implements TLC NAND flash organized as 32G × 8 and provides an eMMC_5.1 memory interface.

Targeted for automotive-grade storage and embedded systems, the device combines a 153‑VFBGA (11.5 × 13 mm) package, AEC-Q100 qualification, and a wide operating range to support designs that require high-density, board-mounted flash storage with standard eMMC connectivity.

Key Features

• Memory Technology FLASH - NAND (TLC) technology delivering non-volatile storage arranged as 32G × 8 for a 256 Gbit capacity.
• Memory Size & Format 256 Gbit total capacity, provided in a FLASH memory format suitable for eMMC storage applications.
• Interface & Performance eMMC_5.1 memory interface with a specified clock frequency of 200 MHz for interface timing.
• Voltage Supply Operates from 2.7 V to 3.6 V, offering compatibility with common system power rails.
• Package 153‑VFBGA package (11.5 × 13 mm) for compact board mounting and high-density integration.
• Operating Range Specified operating ambient temperature from −40 °C to 85 °C (TA).
• Qualification AEC-Q100 qualified and listed with an Automotive grade designation.

Typical Applications

• Automotive Electronic Systems AEC-Q100 qualification and automotive grade designation make the device suitable for in-vehicle storage applications requiring non-volatile NAND flash.
• Embedded Storage eMMC_5.1 interface and 256 Gbit capacity provide board-mounted storage for embedded controllers and modules that require standardized memory connectivity.
• System Integration in Compact Designs The 153‑VFBGA package (11.5 × 13 mm) enables high-density storage integration where PCB space is constrained.

Unique Advantages

• AEC-Q100 Qualification: AEC-Q100 qualification and Automotive grade designation support use in automotive-focused designs.
• High Capacity in a Compact Package: 256 Gbit organized as 32G × 8 in a 153‑VFBGA (11.5 × 13 mm) package for dense board-level storage.
• Standard eMMC_5.1 Interface: Provides a standardized interface for system-level integration and compatibility with eMMC host controllers.
• 200 MHz Clock Specification: Defined clock frequency for interface timing and system planning.
• Wide Voltage Range: 2.7 V to 3.6 V supply range supports common system power architectures.
• Extended Operating Temperature: −40 °C to 85 °C operating range for use in temperature-challenging environments.

Why Choose IC FLASH 256GBIT EMMC 153VFBGA?

IC FLASH 256GBIT EMMC 153VFBGA (IS22TF32G-JCLA1-TR) delivers high-density, board-mounted NAND flash storage with a standardized eMMC_5.1 interface and defined 200 MHz clock specification. Its AEC-Q100 qualification and automotive grade designation position it for applications that require validated reliability and thermal performance in demanding environments.

Engineers designing automotive and embedded systems will find a compact 153‑VFBGA package, broad supply voltage support, and a wide operating temperature range that together simplify integration of non-volatile storage into constrained designs. The device is manufactured by Integrated Silicon Solution Inc., providing traceability to an established memory supplier.

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