IS25LX128-JHLA3
| Part Description |
IC FLASH 128MBIT SPI/OCT 24TFBGA |
|---|---|
| Quantity | 117 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 24-TFBGA (6x8) | Memory Format | FLASH | Technology | FLASH | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 133 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 125°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 24-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Octal I/O | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS25LX128-JHLA3 - 128Mbit Octal SPI Flash Memory
The IS25LX128-JHLA3 is a 128-megabit NOR Flash memory device from ISSI, Integrated Silicon Solution Inc, featuring advanced Octal SPI interface technology. Organized as 16M x 8, this non-volatile memory device delivers high-speed data access at up to 133MHz clock frequency, making it ideal for embedded systems requiring fast boot times and reliable code storage. With its extended industrial temperature range and compact 24-TFBGA package, the IS25LX128 addresses the demanding requirements of industrial, automotive, and IoT applications.
Key Features
- High-Density Flash Memory - 128 megabits (16 megabytes) of non-volatile storage organized as 16M x 8, providing ample space for firmware, code execution, and data logging applications.
- Octal SPI Interface - Advanced 8-bit I/O SPI interface enables significantly faster data throughput compared to standard Quad SPI, supporting rapid boot and high-bandwidth memory access at clock frequencies up to 133MHz.
- Wide Operating Voltage - 2.7V to 3.6V supply voltage range ensures compatibility with both 3.3V and lower-voltage systems, simplifying integration across diverse platform architectures.
- Extended Temperature Range - Operates reliably from -40°C to 125°C (TA), ensuring consistent performance in harsh industrial, automotive, and outdoor deployment environments.
- Compact TFBGA Package - 24-pin Thin Fine-pitch Ball Grid Array (6x8mm) offers space-efficient board mounting with excellent thermal characteristics for high-density designs.
Typical Applications
- Embedded System Boot Storage - Serves as the primary boot code repository for microcontrollers and processors, where the high-speed Octal SPI interface reduces boot latency and improves system responsiveness in industrial controllers and edge computing devices.
- Industrial IoT and Edge Devices - Provides reliable firmware storage for IoT gateways and sensor nodes operating in extended temperature environments, where non-volatile retention ensures program integrity across power cycles and harsh conditions.
- Automotive Electronics - Stores configuration data, calibration tables, and application code for automotive control modules and infotainment systems, where the extended temperature range supports under-hood and cabin mounting locations.
- Network Infrastructure Equipment - Holds boot loaders and configuration files for routers, switches, and network appliances, where the fast read performance enables quick system initialization and firmware updates.
- Medical and Instrumentation Devices - Maintains firmware and calibration data for portable medical devices and test equipment, where the wide voltage range and compact footprint support battery-powered and space-constrained designs.
Unique Advantages
- Faster System Boot Times: Octal SPI interface delivers up to 2x the throughput of Quad SPI, reducing application load times and improving user experience in embedded systems.
- Simplified BOM and Routing: Single-chip 128Mbit density eliminates the need for multiple smaller Flash devices, reducing component count and simplifying PCB layout with fewer trace routing requirements.
- Industrial-Grade Reliability: Extended -40°C to 125°C operating range ensures consistent data retention and access performance across demanding environmental conditions without the need for active cooling.
- Flexible Integration: Wide 2.7V to 3.6V supply range allows direct interfacing with both legacy 3.3V systems and modern low-power processors, avoiding the need for level shifters and reducing power consumption.
- Space-Efficient Design: Compact 24-TFBGA package (6x8mm) minimizes board real estate while providing robust electrical and thermal performance suitable for high-density multi-layer PCB designs.
- Active Lifecycle Status: Currently in active production, ensuring long-term availability and supply chain stability for new designs and ongoing manufacturing programs.
Why Choose IS25LX128-JHLA3?
The IS25LX128-JHLA3 represents an excellent choice for engineers designing next-generation embedded systems that demand high-speed non-volatile storage with industrial-grade reliability. Its combination of Octal SPI performance, extended temperature tolerance, and compact packaging makes it particularly well-suited for space-constrained applications in industrial automation, automotive electronics, and IoT edge computing where fast boot times and environmental resilience are critical.
By selecting the IS25LX128-JHLA3, design teams gain a proven Flash memory solution that balances performance, density, and reliability while maintaining the flexibility to support both current and future platform requirements. The active lifecycle status and broad operating specifications provide confidence for long-term product roadmaps and volume manufacturing.
Get a Quote Today
Contact our sales team to discuss your memory requirements and receive pricing for the IS25LX128-JHLA3. Our technical specialists can assist with integration guidance, development samples, and volume supply planning to support your project from prototype through production.
