IS25LX256-JHLA3

IC FLASH 256MBIT SPI/OCT 24TFBGA
Part Description

IC FLASH 256MBIT SPI/OCT 24TFBGA

Quantity 512 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package24-TFBGA (6x8)Memory FormatFLASHTechnologyFLASH
Memory Size256 MbitAccess TimeN/AGradeAutomotive
Clock Frequency133 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 125°C (TA)Write Cycle Time Word PageN/APackaging24-TBGA
Mounting MethodNon-VolatileMemory InterfaceSPI - Octal I/OMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS25LX256-JHLA3 - 256Mbit Octal SPI Flash Memory

The IS25LX256-JHLA3 is a 256-megabit serial NOR flash memory device from ISSI that features advanced Octal SPI interface technology for high-performance embedded applications. Organized as 32M x 8, this flash memory delivers fast read throughput with an operating frequency up to 133MHz while maintaining compatibility with standard SPI protocols. Ideal for automotive, industrial, and consumer electronics requiring reliable non-volatile storage with extended temperature operation.

Key Features

  • High-Density Flash Storage - 256Mbit (32 megabytes) of non-volatile flash memory provides ample space for firmware, data logging, and boot code storage in embedded systems.
  • Octal SPI Interface - Eight I/O lines enable significantly higher data throughput compared to traditional quad SPI, supporting faster boot times and improved system responsiveness.
  • 133MHz Clock Frequency - High-speed operation allows rapid access to stored code and data, reducing latency in time-critical applications.
  • Wide Operating Voltage - 2.7V to 3.6V supply range ensures compatibility with both 3.3V and lower-voltage systems, simplifying integration across various platforms.
  • Extended Temperature Range - -40°C to 125°C operation qualifies this memory for demanding industrial and automotive environments where temperature extremes are common.
  • Compact 24-TFBGA Package - The 6mm x 8mm ball grid array footprint minimizes board space while providing robust connectivity in high-density designs.

Typical Applications

  • Automotive Electronics - This flash memory serves as reliable code and data storage for automotive control modules, instrument clusters, and infotainment systems where extended temperature tolerance ensures consistent operation across extreme environmental conditions.
  • Industrial Automation - Provides non-volatile program storage for PLCs, motor drives, and HMI controllers where the high-speed Octal SPI interface enables fast system boot and real-time firmware updates.
  • IoT Edge Devices - Supports firmware storage and data logging in connected sensors, gateways, and smart meters where the compact package and wide voltage range simplify integration into battery-powered and space-constrained designs.
  • Consumer Electronics - Enables boot code storage and configuration data retention in smart home devices, wearables, and appliances where the 256Mbit density balances cost and capacity requirements.
  • Medical Instruments - Offers dependable non-volatile storage for portable diagnostic equipment and patient monitoring devices where extended temperature operation and high reliability are critical for field deployment.

Unique Advantages

  • Accelerated System Boot Times: Octal SPI interface delivers up to 8x faster read performance compared to single-lane SPI, reducing initialization delays and improving user experience.
  • Simplified BOM Consolidation: Wide 2.7V to 3.6V supply range eliminates the need for dedicated voltage regulators in many designs, reducing component count and board complexity.
  • Enhanced Thermal Reliability: -40°C to 125°C operating range ensures data integrity and consistent performance in harsh industrial and automotive environments without requiring additional thermal management.
  • Optimized Board Space Utilization: Compact 24-TFBGA package with 6mm x 8mm footprint enables higher component density in space-constrained applications while maintaining robust electrical connectivity.
  • Proven Flash Technology: Non-volatile flash architecture ensures data retention without power, eliminating the complexity and cost of battery backup circuits required by volatile memory solutions.
  • Backwards Compatible Interface: Maintains SPI protocol compatibility while offering Octal I/O extension, allowing designers to leverage existing software infrastructure while gaining performance benefits.

Why Choose IS25LX256-JHLA3?

The IS25LX256-JHLA3 strikes an optimal balance between density, performance, and environmental ruggedness for embedded systems requiring fast, reliable non-volatile storage. Its Octal SPI interface positions it as a future-ready solution for designs transitioning from traditional quad SPI architectures, delivering measurable boot time improvements without requiring wholesale software rewrites. The extended temperature specification and compact package make it particularly well-suited for industrial and automotive applications where space, thermal stress, and reliability are primary concerns.

For design teams seeking to reduce boot latency, consolidate voltage rails, or meet stringent temperature requirements, this flash memory provides a proven, cost-effective solution backed by ISSI's expertise in memory technology.

Get Started Today

Contact our technical sales team to request a quote, discuss volume pricing, or receive application-specific design guidance for integrating the IS25LX256-JHLA3 into your next project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up