IS25LX512M-JHA3-TR

The IS25LX512M-JHA3-TR is a 512 Mbit non-volatile FLASH memory device with an Octal SPI (Octal I/O) interface and a 24-TFBGA package. It provides serial flash storage organized as 64M x 8 and operates from a 2.7 V to 3.6 V supply.

Designed for systems requiring serial FLASH memory with high-density capacity and Octal I/O, the device offers a 133 MHz clock frequency and an extended operating temperature range of -40°C to 125°C for use in temperature-sensitive environments.

Key Features

• Memory Type & Technology Non-volatile FLASH memory delivering 512 Mbit of storage capacity organized as 64M x 8.
• Interface SPI – Octal I/O memory interface for serial communication using Octal SPI signaling.
• Clock Performance Supports a clock frequency of 133 MHz for serial access timing.
• Voltage Supply Operates from 2.7 V to 3.6 V, accommodating common 3 V system rails.
• Operating Temperature Rated for -40°C to 125°C (TA), supporting wide-temperature operation.
• Package 24-TFBGA package (6×8 mm) offering a compact BGA footprint.
• Memory Format & Organization FLASH memory organized as 64M x 8 for predictable addressing and integration.

Typical Applications

• Embedded systems — Non-volatile serial FLASH storage using Octal SPI for code and data storage in space-constrained designs.
• Firmware and boot storage — 512 Mbit capacity supports storage of firmware images and boot code in systems requiring external FLASH.
• Temperature-challenged environments — The -40°C to 125°C operating range supports deployments where extended temperature tolerance is required.

Unique Advantages

• High-density storage: 512 Mbit FLASH provides substantial capacity while maintaining a small package footprint.
• Octal SPI interface: Octal I/O delivers a serial interface option for higher parallelism within a serial bus architecture.
• Fast serial clock support: 133 MHz clock frequency enables higher-speed serial access consistent with Octal SPI operation.
• Flexible supply range: 2.7 V to 3.6 V compatibility eases integration into 3 V system designs.
• Wide operating temperature: -40°C to 125°C rating supports designs exposed to broad temperature conditions.
• Compact BGA package: 24-TFBGA (6×8) provides a low-profile, solderable package for space-constrained PCBs.

Why Choose IS25LX512M-JHA3-TR?

The IS25LX512M-JHA3-TR combines high-density FLASH memory with an Octal SPI interface and a compact 24-TFBGA package, aimed at designs that require substantial non-volatile storage in a small footprint. With a 133 MHz clock frequency, 2.7 V–3.6 V supply range, and -40°C to 125°C operating temperature, it is positioned for system-level integration where capacity, serial performance, and thermal tolerance matter.

This device is suitable for engineers specifying external serial FLASH for firmware, boot storage, or general-purpose non-volatile data storage, offering predictable memory organization (64M x 8) and a BGA package for streamlined board implementation.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the IS25LX512M-JHA3-TR.