IS25LX256-JHLE-TR

IC FLASH 256MBIT SPI/OCT 24TFBGA
Part Description

IC FLASH 256MBIT SPI/OCT 24TFBGA

Quantity 579 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package24-TFBGA (6x8)Memory FormatFLASHTechnologyFLASH
Memory Size256 MbitAccess TimeN/AGradeAutomotive
Clock Frequency133 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging24-TBGA
Mounting MethodNon-VolatileMemory InterfaceSPI - Octal I/OMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS25LX256-JHLE-TR – IC FLASH 256MBIT SPI/OCT 24TFBGA

The IS25LX256-JHLE-TR from ISSI is a 256 Mbit non-volatile FLASH memory device organized as 32M × 8 and accessed via an SPI – Octal I/O interface. It provides a high-density serial FLASH option in a compact 24-TFBGA (6×8) package and operates across a wide voltage and temperature range.

This device is intended for systems that require serial/octally accessed non-volatile storage, offering a defined clock frequency and industrial temperature rating for embedded and electronic applications.

Key Features

  • Memory Type  Non-volatile FLASH memory with a total capacity of 256 Mbit organized as 32M × 8.
  • Interface  SPI – Octal I/O interface for serial/octally accessed memory operations.
  • Clock Performance  Supported clock frequency of 133 MHz for serial transfers.
  • Voltage Supply  Operates from 2.7 V to 3.6 V, enabling use across standard 3.3 V systems.
  • Temperature Range  Rated for operation from −40°C to 105°C (TA), suitable for extended-temperature applications.
  • Package  Available in a 24-TFBGA package (6×8) for compact board-level integration.
  • Memory Format  FLASH memory format providing persistent storage for code or data.

Typical Applications

  • Embedded Systems  Non-volatile storage for firmware, lookup tables, and configuration data in embedded controllers and modules.
  • Industrial Electronics  Storage for calibration data and system parameters where extended temperature operation is required.
  • Consumer and IoT Devices  Serial FLASH storage using Octal SPI for compact devices requiring higher-density external memory.

Unique Advantages

  • High-density storage: 256 Mbit capacity in a single 32M × 8 device reduces the need for multiple parts.
  • Octal SPI interface: SPI – Octal I/O enables wider data paths for higher throughput compared to standard SPI modes.
  • Wide voltage compatibility: 2.7 V to 3.6 V supply range supports common 3.3 V system rails.
  • Extended temperature rating: −40°C to 105°C operation addresses thermal requirements for industrial and ruggedized designs.
  • Compact BGA package: 24-TFBGA (6×8) saves board space while providing a reliable surface-mount footprint.

Why Choose IS25LX256-JHLE-TR?

The IS25LX256-JHLE-TR combines a 256 Mbit FLASH capacity with an SPI – Octal I/O interface and a 133 MHz clock rate to deliver serial non-volatile storage suitable for space-constrained, temperature-challenged designs. Its 2.7–3.6 V supply range and 24-TFBGA (6×8) package make it appropriate for embedded, industrial, and compact consumer applications that require persistent memory with defined electrical and thermal characteristics.

Designed and manufactured by ISSI, this device is aimed at engineers seeking a straightforward high-density FLASH solution with octal SPI access and a compact board-level footprint.

Request a quote or contact sales to submit a request for pricing and availability for the IS25LX256-JHLE-TR.

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