IS25LX256-JHLE-TR
| Part Description |
IC FLASH 256MBIT SPI/OCT 24TFBGA |
|---|---|
| Quantity | 579 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 24-TFBGA (6x8) | Memory Format | FLASH | Technology | FLASH | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 133 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 24-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Octal I/O | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS25LX256-JHLE-TR – IC FLASH 256MBIT SPI/OCT 24TFBGA
The IS25LX256-JHLE-TR from ISSI is a 256 Mbit non-volatile FLASH memory device organized as 32M × 8 and accessed via an SPI – Octal I/O interface. It provides a high-density serial FLASH option in a compact 24-TFBGA (6×8) package and operates across a wide voltage and temperature range.
This device is intended for systems that require serial/octally accessed non-volatile storage, offering a defined clock frequency and industrial temperature rating for embedded and electronic applications.
Key Features
- Memory Type Non-volatile FLASH memory with a total capacity of 256 Mbit organized as 32M × 8.
- Interface SPI – Octal I/O interface for serial/octally accessed memory operations.
- Clock Performance Supported clock frequency of 133 MHz for serial transfers.
- Voltage Supply Operates from 2.7 V to 3.6 V, enabling use across standard 3.3 V systems.
- Temperature Range Rated for operation from −40°C to 105°C (TA), suitable for extended-temperature applications.
- Package Available in a 24-TFBGA package (6×8) for compact board-level integration.
- Memory Format FLASH memory format providing persistent storage for code or data.
Typical Applications
- Embedded Systems Non-volatile storage for firmware, lookup tables, and configuration data in embedded controllers and modules.
- Industrial Electronics Storage for calibration data and system parameters where extended temperature operation is required.
- Consumer and IoT Devices Serial FLASH storage using Octal SPI for compact devices requiring higher-density external memory.
Unique Advantages
- High-density storage: 256 Mbit capacity in a single 32M × 8 device reduces the need for multiple parts.
- Octal SPI interface: SPI – Octal I/O enables wider data paths for higher throughput compared to standard SPI modes.
- Wide voltage compatibility: 2.7 V to 3.6 V supply range supports common 3.3 V system rails.
- Extended temperature rating: −40°C to 105°C operation addresses thermal requirements for industrial and ruggedized designs.
- Compact BGA package: 24-TFBGA (6×8) saves board space while providing a reliable surface-mount footprint.
Why Choose IS25LX256-JHLE-TR?
The IS25LX256-JHLE-TR combines a 256 Mbit FLASH capacity with an SPI – Octal I/O interface and a 133 MHz clock rate to deliver serial non-volatile storage suitable for space-constrained, temperature-challenged designs. Its 2.7–3.6 V supply range and 24-TFBGA (6×8) package make it appropriate for embedded, industrial, and compact consumer applications that require persistent memory with defined electrical and thermal characteristics.
Designed and manufactured by ISSI, this device is aimed at engineers seeking a straightforward high-density FLASH solution with octal SPI access and a compact board-level footprint.
Request a quote or contact sales to submit a request for pricing and availability for the IS25LX256-JHLE-TR.