IS42S16160L-7BLI

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 1,834 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160L-7BLI - 256Mbit SDRAM in Compact 54-TFBGA Package

The IS42S16160L-7BLI is a 256-megabit synchronous DRAM optimized for space-constrained embedded applications requiring reliable parallel memory access. Built on proven SDRAM technology with a 16M x 16 organization, this device delivers predictable performance across industrial temperature ranges while maintaining compatibility with standard LVTTL interfaces.

Designed for systems demanding cost-effective volatile memory with wide temperature tolerance, the IS42S16160L-7BLI operates from -40°C to 85°C and supports clock frequencies up to 143MHz. Its compact 54-TFBGA footprint (8x8mm) makes it particularly suitable for designs where board space is at a premium.

Key Features

  • Memory Architecture - 256 megabit capacity organized as 16M x 16, providing flexible addressing and efficient data storage for embedded computing applications.
  • Clock Performance - Operates at frequencies up to 143MHz with 5.4ns access time, delivering consistent throughput for real-time data processing requirements.
  • Power Supply - Standard 3V to 3.6V supply voltage simplifies integration with common 3.3V system architectures and reduces power management complexity.
  • Interface Compatibility - LVTTL-compatible parallel interface enables straightforward connection to microprocessors, FPGAs, and SoCs using standard logic levels.
  • Package Efficiency - 54-pin TFBGA measuring just 8x8mm provides high I/O density while minimizing PCB footprint requirements.
  • Temperature Range - Qualified for -40°C to 85°C operation ensures reliable performance across industrial environments without requiring active cooling systems.

Typical Applications

  • Industrial Controllers - This SDRAM provides working memory for programmable logic controllers and industrial computing modules where the extended temperature range ensures reliable operation in factory floor environments subject to temperature fluctuations.
  • Embedded Computing Platforms - The 256Mbit capacity and parallel interface make this device well-suited for SBC (single-board computer) designs running embedded Linux or RTOS where cost-effective volatile memory with predictable latency is required.
  • Network Infrastructure Equipment - The combination of moderate capacity and LVTTL interface supports buffer memory applications in routers, switches, and gateway devices where synchronous operation aligns with system clock architectures.
  • Imaging and Display Systems - The 16M x 16 organization efficiently stores framebuffer data for industrial displays and machine vision applications where the compact package enables space-efficient multi-board assemblies.
  • Automotive Electronics - Industrial temperature qualification supports use in automotive infotainment, instrument clusters, and ADAS subsystems operating in passenger compartment environments within the -40°C to 85°C range.

Unique Advantages

  • Reduced Board Space Requirements: The 8x8mm TFBGA package delivers significantly smaller footprint compared to TSOP alternatives, enabling more compact product designs or freeing PCB area for additional functionality.
  • Simplified Sourcing and BOM Management: Active lifecycle status from an established memory manufacturer reduces supply chain risk and simplifies long-term product support planning.
  • Lower System Cost: Standard SDRAM technology with common voltage and interface requirements eliminates the need for specialized support circuitry, reducing overall system BOM cost compared to proprietary memory solutions.
  • Design Reuse Across Temperature Ranges: The -40°C to 85°C qualification allows the same design to serve both commercial and industrial applications, reducing engineering overhead and inventory complexity.
  • Proven Technology Base: Mature SDRAM architecture provides well-understood timing characteristics and broad ecosystem support, accelerating development and reducing validation risk.
  • Power Efficiency in Standby: Synchronous architecture enables efficient power management modes, supporting battery-backed or low-power embedded applications without requiring specialized low-power DRAM variants.

Why Choose IS42S16160L-7BLI?

This device occupies a practical middle ground in embedded memory selection - it offers sufficient capacity for many industrial and embedded applications without the cost premium of higher-density or specialized memory types. The industrial temperature rating and active availability make it particularly appropriate for designs requiring multi-year production runs with consistent supply. Engineers selecting this SDRAM benefit from straightforward integration with common controller interfaces and voltage rails, while the TFBGA package addresses space constraints without introducing complex assembly requirements.

For product designs targeting industrial control, automotive subsystems, or embedded computing applications where proven technology, temperature tolerance, and compact packaging align with system requirements, the IS42S16160L-7BLI provides a cost-effective solution backed by ISSI's established presence in the memory market.

Get a Quote

Contact our sales team to discuss volume pricing, delivery schedules, and technical support for integrating the IS42S16160L-7BLI into your design. Our engineers can provide reference designs, timing analysis assistance, and guidance on optimal board layout practices for TFBGA packages.

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