IS42S16160L-7BL

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 294 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization16M x 16
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS42S16160L-7BL – IC DRAM 256MBIT PAR 54TFBGA

The IS42S16160L-7BL is a 256 Mbit volatile SDRAM organized as 16M × 16 with a 54-TFBGA (8×8) package. It provides single-device external memory in a compact ball-grid array package for designs that require synchronous DRAM storage.

Key electrical and timing characteristics include a 143 MHz clock frequency, 5.4 ns access time, LVTTL memory interface, and a supply voltage range of 3.0 V to 3.6 V. The device is specified for ambient operation from 0°C to 70°C.

Key Features

  • Memory Architecture 256 Mbit SDRAM organized as 16M × 16, offering parallel data paths for board-level memory expansion.
  • Performance Specified with a 143 MHz clock frequency and 5.4 ns access time to support synchronous memory transactions.
  • Interface LVTTL-compatible memory interface for integration with LVTTL signaling domains.
  • Power Operates from a 3.0 V to 3.6 V supply range, matching common 3 V SDRAM supply rails.
  • Package 54-TFBGA (8×8) supplier device package, providing a compact BGA footprint for high-density board layouts.
  • Operating Temperature Rated for ambient temperatures from 0°C to 70°C (TA), suitable for room-temperature electronic assemblies.

Typical Applications

  • Board-level memory expansion — Provides 256 Mbit SDRAM capacity in a small 54-TFBGA package for space-constrained PCBs.
  • Systems requiring synchronous DRAM — Matches designs that require a 16M × 16 SDRAM organized device with LVTTL signaling.
  • High-speed buffering — 5.4 ns access time and 143 MHz clock frequency support applications needing fast synchronous access.
  • Ambient-temperature electronics — Intended for use in equipment operating within a 0°C to 70°C ambient range.

Unique Advantages

  • Compact BGA footprint: 54-TFBGA (8×8) package saves board area while enabling high-density placement.
  • Parallel 16-bit organization: 16M × 16 configuration simplifies data bus routing for 16-bit systems.
  • Specified timing: 5.4 ns access time and 143 MHz clock frequency provide defined performance characteristics for system timing budgets.
  • Standard 3 V supply range: 3.0 V to 3.6 V operation aligns with common SDRAM power rails for straightforward power design.
  • LVTTL interface compatibility: LVTTL signaling support enables integration with compatible logic families.
  • Room-temperature rating: Clear ambient temperature specification of 0°C to 70°C for appropriate deployment environments.

Why Choose IS42S16160L-7BL?

The IS42S16160L-7BL offers a clear set of electrical, timing, and packaging specifications for designers who need a 256 Mbit SDRAM device in a compact 54-TFBGA form factor. Its defined clock, access time, LVTTL interface, and supply range make it suitable for systems that require predictable synchronous DRAM behavior and a 16-bit data organization.

This device suits designs that prioritize a compact package and standard 3 V SDRAM operation while operating within a 0°C to 70°C ambient range. The explicit specifications simplify component selection and system integration for projects requiring a known performance envelope.

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