IS42S16800F-6B-TR
| Part Description |
IC DRAM 128MBIT PAR 54TFBGA |
|---|---|
| Quantity | 357 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S16800F-6B-TR – IC DRAM 128MBIT PAR 54TFBGA
The IS42S16800F-6B-TR from Integrated Silicon Solution Inc is a volatile SDRAM device offering 128 Mbit of parallel memory in an 8M × 16 organization. It is provided in a 54-TFBGA (8×8) package and is specified for operation at a 166 MHz clock with a 5.4 ns access time.
This SDRAM is intended for designs that require a compact, parallel DRAM solution operating from 3.0 V to 3.6 V and within an ambient temperature range of 0°C to 70°C.
Key Features
- Memory Type & Format Volatile SDRAM organized as 8M × 16, delivering a total memory size of 128 Mbit.
- Interface Parallel memory interface for standard DRAM access patterns.
- Performance Specified clock frequency of 166 MHz with an access time of 5.4 ns to support high-speed read/write cycles.
- Voltage Supply Operates from 3.0 V to 3.6 V, matching common 3V system rails.
- Package 54-TFBGA (8×8) package case providing a compact board footprint for high-density memory.
- Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).
Unique Advantages
- Parallel throughput: 166 MHz clock and parallel interface enable efficient data transfer for designs that require fast volatile storage.
- Deterministic timing: 5.4 ns access time gives predictable memory latency for time-sensitive applications.
- Compact package: 54-TFBGA (8×8) reduces PCB area while maintaining 128 Mbit density.
- Standard supply range: 3.0 V–3.6 V compatibility simplifies integration with typical 3V system power domains.
- Clear memory organization: 8M × 16 layout supports straightforward address and data mapping for parallel DRAM designs.
Why Choose IS42S16800F-6B-TR?
The IS42S16800F-6B-TR positions itself as a compact, high-speed parallel SDRAM option from Integrated Silicon Solution Inc, combining a 128 Mbit density with a 54-TFBGA package and defined timing characteristics. Its specified clock rate, access time, voltage range, and operating temperature make it suitable for systems that require a reliable parallel DRAM component with predictable performance.
Engineers specifying this device will benefit from clear electrical and mechanical parameters—memory organization (8M × 16), supply voltage (3.0 V–3.6 V), clock frequency (166 MHz), and ambient temperature rating (0°C–70°C)—to assess fit for their designs and long-term deployment considerations.
If you would like pricing, lead-time information, or to request a quote for the IS42S16800F-6B-TR, please request a quote or contact sales to discuss availability and ordering details.