IS42S16800E-7TLI-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 916 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800E-7TLI-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S16800E-7TLI-TR is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface. It uses a pipelined, fully synchronous architecture with internal quad-bank operation to support high-speed data transfer and efficient row access/precharge hiding.

Designed for 3.3V memory systems (VDD/VDDQ = 3.3V) with an operational supply range of 3.0 V to 3.6 V and industrial temperature availability (–40°C to 85°C), this 54-pin TSOP II packaged device targets systems requiring reliable, mid‑density synchronous DRAM.

Key Features

  • Memory Architecture 128 Mbit SDRAM organized as 8M × 16 with quad-bank internal configuration for parallel row/column operation and improved throughput.
  • High-Speed Synchronous Operation Fully synchronous design with all signals referenced to the rising clock edge; supported clock frequency for the -7 speed grade is 143 MHz and access time from clock is 5.4 ns.
  • Programmable Burst and CAS Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (Sequential/Interleave). CAS latency is programmable to 2 or 3 clocks.
  • Refresh and Power Modes Auto Refresh and Self Refresh supported with 4096 refresh cycles every 64 ms; includes power‑saving power‑down functionality.
  • Interface and Signaling LVTTL-compatible interface supporting random column address access every clock cycle and burst read/write operations with burst termination commands.
  • Supply and Packaging Designed for 3.3V VDD/VDDQ operation (supply range 3.0–3.6V) in a 54-pin TSOP II (0.400", 10.16 mm width) package for compact board-level placement.
  • Industrial Temperature Range Rated for operation from –40°C to 85°C (TA), suitable for temperature-demanding environments.

Typical Applications

  • Industrial Systems Use where industrial temperature range and reliable synchronous memory operation are required.
  • Embedded Memory Subsystems Suitable as main or buffer memory in 3.3V synchronous memory designs that need mid-density DRAM.
  • High-Speed Parallel Data Buffers Appropriate for designs leveraging pipelined SDRAM and burst access at up to 143 MHz clock rates.

Unique Advantages

  • Synchronous Pipelined Architecture: Pipeline design with all signals registered to the clock edge enables predictable timing and high throughput.
  • Flexible Burst Control: Programmable burst lengths and sequences allow tuning for sequential or interleaved access patterns to match system requirements.
  • Selectable CAS Latency: CAS latency programmable to 2 or 3 clocks provides trade-offs between latency and clock rate for timing optimization.
  • Industry-Grade Temperature Range: Operation from –40°C to 85°C supports deployment in harsher environments where extended temperature tolerance is needed.
  • Standard 54‑TSOP II Package: Compact 54-pin TSOP II footprint simplifies board-level integration in space-constrained designs.
  • 3.3V Supply Compatibility: Designed for 3.3V VDD/VDDQ with a supply range of 3.0–3.6V to align with common memory power rails.

Why Choose IS42S16800E-7TLI-TR?

The IS42S16800E-7TLI-TR combines a synchronous, pipelined SDRAM architecture with flexible burst and CAS programmability to deliver a reliable mid-density memory solution for 3.3V systems. Its quad-bank organization and supported 143 MHz clock rate enable efficient high-speed data transfers while maintaining industry-temperature operation.

This device is well suited for designers needing a compact 128 Mbit DRAM in a 54‑pin TSOP II package where predictable timing, refresh management, and selectable latency/burst modes are required for embedded and industrial memory subsystems.

Request a quote or submit an inquiry to receive pricing and availability information for the IS42S16800E-7TLI-TR.

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