IS42S16800E-7TL-TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 1,479 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800E-7TL-TR – IC DRAM 128MBIT PAR 54TSOP II

The IS42S16800E-7TL-TR is a 128 Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with a parallel LVTTL interface. It implements a quad-bank, fully synchronous pipeline architecture to deliver predictable, clock-referenced memory access for board-level systems requiring 128 Mbit DRAM in a compact 54-pin TSOP II package.

Designed for 3.0–3.6 V systems (3.3 V VDD specified in the device datasheet) and a specified operating ambient range of 0°C to 70°C, this SDRAM supports high-throughput burst operations and programmable timing to match system performance requirements.

Key Features

  • Core Memory 128 Mbit SDRAM organized as 8M × 16, implemented as a quad-bank DRAM for concurrent row/column operations.
  • Synchronous, Clocked Interface Fully synchronous operation with all signals referenced to the rising edge of CLK; supported clock frequencies include 200, 166, 143 and 133 MHz (–7 speed grade corresponds to 143 MHz in the timing table).
  • Low Access Time CAS latency and timing options provide access times down to 5.4 ns (CAS Latency = 3 at the –7 grade), enabling low-latency read operations.
  • Programmable Burst and CAS Options Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (Sequential/Interleave); CAS latency programmable to 2 or 3 clocks.
  • Refresh and Power Modes Supports Auto Refresh, Self Refresh and CBR Auto Refresh; device requires 4096 refresh cycles every 64 ms as specified.
  • Interface and Signaling LVTTL signaling for inputs/outputs and a parallel memory interface optimized for board-level integration.
  • Supply and Package Supply range 3.0–3.6 V with 3.3 V VDD indicated in the datasheet; supplied in a 54-pin TSOP II package (0.400", 10.16 mm width) for compact PCB footprints.

Typical Applications

  • Board-level SDRAM expansion Provides 128 Mbit of synchronous DRAM capacity for systems requiring parallel memory in a 54-pin TSOP II footprint.
  • High-throughput burst buffering Programmable burst lengths and CAS latency options support burst read/write operations for systems that need efficient block transfers.
  • 3.3 V memory subsystems Designed for systems operating within a 3.0–3.6 V supply range with LVTTL interface signaling.

Unique Advantages

  • Flexible timing and burst control: Programmable CAS latency (2, 3) and burst length/sequence settings let designers tune latency and throughput to match system timing.
  • Deterministic synchronous operation: All signals referenced to the positive clock edge yield predictable timing and simplify timing closure for clocked memory systems.
  • Compact TSOP II packaging: The 54-pin TSOP II (10.16 mm width) provides a small board footprint for space-constrained designs.
  • Standard 3.3 V supply compatibility: Operates within a 3.0–3.6 V supply window with 3.3 V VDD specified in the datasheet to match common system rails.
  • Refresh and power management: Built-in Auto Refresh and Self Refresh modes with specified refresh cycle requirements help maintain data integrity while supporting power-saving modes.

Why Choose IS42S16800E-7TL-TR?

The IS42S16800E-7TL-TR provides a compact, fully synchronous 128 Mbit DRAM solution with programmable timing and burst features suited to systems that require predictable, clock-referenced memory performance. Its 54-pin TSOP II package and 3.0–3.6 V supply compatibility make it straightforward to integrate into board-level memory subsystems where space and standard supply voltages are considerations.

This device is appropriate for designers seeking a straightforward SDRAM component with configurable latency and burst behavior, enabling alignment with specific data-transfer and timing requirements while adhering to documented timing parameters and refresh specifications.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the IS42S16800E-7TL-TR.

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