IS42S16800E-7BLI
| Part Description |
IC DRAM 128MBIT PAR 54TFBGA |
|---|---|
| Quantity | 911 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S16800E-7BLI – IC DRAM 128MBIT PAR 54TFBGA
The IS42S16800E-7BLI is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface and LVTTL signaling. It implements a quad-bank, fully synchronous architecture optimized for high-speed, pipelined data transfer in digital systems.
Targeted at designs that require compact, board-level memory, the device offers programmable burst operation, selectable CAS latency, and industry temperature availability to support robust system-level integration and performance predictability.
Key Features
- Memory Core 128 Mbit SDRAM organized as 8M × 16 with a quad-bank internal configuration for pipelined access and efficient row/column operations.
- Performance -7 speed grade with a clock frequency of 143 MHz and an access time of 5.4 ns (CAS latency = 3), enabling low-latency transfer when configured for CL=3.
- Programmable Burst and Latency Supports programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); CAS latency selectable at 2 or 3 clocks to match system timing.
- Refresh and Power Modes Auto Refresh and Self Refresh supported with 4096 refresh cycles every 64 ms, plus power-down capability for power-managed applications.
- Interface and Signaling Parallel memory interface with LVTTL-compatible I/O signaling for straightforward integration with synchronous system clocks.
- Supply Voltage Operates with VDD/VDDQ at 3.3 V and a specified supply range of 3.0 V to 3.6 V.
- Package & Mounting 54-ball TF-BGA package (8 × 8) in a compact 54-TFBGA footprint suitable for space-constrained boards.
- Operating Range Industrial temperature availability with an operating ambient temperature range of −40 °C to 85 °C (TA).
Typical Applications
- Industrial Memory Subsystems Use where industrial temperature operation and robust refresh modes are required for reliable system memory.
- High-Speed Data Buffering Local frame or data buffering in systems that benefit from 143 MHz clock operation and low access latency (5.4 ns CL=3).
- Embedded System Memory Parallel SDRAM expansion for synchronous digital designs needing a 128 Mbit density with programmable burst behavior and selectable CAS latency.
Unique Advantages
- Flexible Performance Scaling: -7 speed grade provides 143 MHz clock operation and 5.4 ns access time (CL=3) to balance throughput and latency requirements.
- Programmable Transfer Modes: Configurable burst length and sequence plus selectable CAS latencies allow tuning for diverse access patterns and system timings.
- Power and Refresh Control: Auto Refresh, Self Refresh, and power-down modes help manage power consumption while maintaining data integrity via 4096 refresh cycles every 64 ms.
- Industrial Temperature Support: Rated for −40 °C to 85 °C ambient operation to meet temperature-hardened deployment needs.
- Compact BGA Footprint: 54-TFBGA (8×8) package enables higher board density and simplified routing in space-constrained designs.
- Standard 3.3 V Supply: VDD and VDDQ at 3.3 V with a 3.0 V–3.6 V supply window aligns with common system power rails.
Why Choose IC DRAM 128MBIT PAR 54TFBGA?
The IS42S16800E-7BLI delivers a balanced combination of density, synchronous performance, and configurability for systems that require predictable, low-latency SDRAM. Its programmable burst features and selectable CAS latency make it adaptable to a variety of memory access patterns, while industrial temperature availability and compact TF-BGA packaging support deployment in constrained or temperature-challenging environments.
This device is suitable for designers and procurement teams seeking a 128 Mbit parallel SDRAM solution with clear, verifiable timing and refresh characteristics, compact package options, and industry-oriented operating range.
Request a quote or submit an RFQ to receive pricing and availability information for IS42S16800E-7BLI and to discuss integration details for your design.