IS42S16800E-7BLI

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 911 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800E-7BLI – IC DRAM 128MBIT PAR 54TFBGA

The IS42S16800E-7BLI is a 128 Mbit synchronous DRAM (SDRAM) organized as 8M × 16 with a parallel memory interface and LVTTL signaling. It implements a quad-bank, fully synchronous architecture optimized for high-speed, pipelined data transfer in digital systems.

Targeted at designs that require compact, board-level memory, the device offers programmable burst operation, selectable CAS latency, and industry temperature availability to support robust system-level integration and performance predictability.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 8M × 16 with a quad-bank internal configuration for pipelined access and efficient row/column operations.
  • Performance -7 speed grade with a clock frequency of 143 MHz and an access time of 5.4 ns (CAS latency = 3), enabling low-latency transfer when configured for CL=3.
  • Programmable Burst and Latency Supports programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave); CAS latency selectable at 2 or 3 clocks to match system timing.
  • Refresh and Power Modes Auto Refresh and Self Refresh supported with 4096 refresh cycles every 64 ms, plus power-down capability for power-managed applications.
  • Interface and Signaling Parallel memory interface with LVTTL-compatible I/O signaling for straightforward integration with synchronous system clocks.
  • Supply Voltage Operates with VDD/VDDQ at 3.3 V and a specified supply range of 3.0 V to 3.6 V.
  • Package & Mounting 54-ball TF-BGA package (8 × 8) in a compact 54-TFBGA footprint suitable for space-constrained boards.
  • Operating Range Industrial temperature availability with an operating ambient temperature range of −40 °C to 85 °C (TA).

Typical Applications

  • Industrial Memory Subsystems Use where industrial temperature operation and robust refresh modes are required for reliable system memory.
  • High-Speed Data Buffering Local frame or data buffering in systems that benefit from 143 MHz clock operation and low access latency (5.4 ns CL=3).
  • Embedded System Memory Parallel SDRAM expansion for synchronous digital designs needing a 128 Mbit density with programmable burst behavior and selectable CAS latency.

Unique Advantages

  • Flexible Performance Scaling: -7 speed grade provides 143 MHz clock operation and 5.4 ns access time (CL=3) to balance throughput and latency requirements.
  • Programmable Transfer Modes: Configurable burst length and sequence plus selectable CAS latencies allow tuning for diverse access patterns and system timings.
  • Power and Refresh Control: Auto Refresh, Self Refresh, and power-down modes help manage power consumption while maintaining data integrity via 4096 refresh cycles every 64 ms.
  • Industrial Temperature Support: Rated for −40 °C to 85 °C ambient operation to meet temperature-hardened deployment needs.
  • Compact BGA Footprint: 54-TFBGA (8×8) package enables higher board density and simplified routing in space-constrained designs.
  • Standard 3.3 V Supply: VDD and VDDQ at 3.3 V with a 3.0 V–3.6 V supply window aligns with common system power rails.

Why Choose IC DRAM 128MBIT PAR 54TFBGA?

The IS42S16800E-7BLI delivers a balanced combination of density, synchronous performance, and configurability for systems that require predictable, low-latency SDRAM. Its programmable burst features and selectable CAS latency make it adaptable to a variety of memory access patterns, while industrial temperature availability and compact TF-BGA packaging support deployment in constrained or temperature-challenging environments.

This device is suitable for designers and procurement teams seeking a 128 Mbit parallel SDRAM solution with clear, verifiable timing and refresh characteristics, compact package options, and industry-oriented operating range.

Request a quote or submit an RFQ to receive pricing and availability information for IS42S16800E-7BLI and to discuss integration details for your design.

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