IS42S16800E-7BL

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 187 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800E-7BL – IC DRAM 128MBIT PAR 54TFBGA

The IS42S16800E-7BL is a 128 Mbit synchronous DRAM organized as 8M × 16, implemented with a quad-bank, fully synchronous pipeline architecture. It is designed for 3.3 V memory systems and provides parallel SDRAM operation with programmable burst and latency settings.

Designed for systems that require low-latency, high-throughput parallel memory, the device delivers selectable CAS latency, burst lengths and sequences, and built-in refresh modes to support sustained data transfers and predictable timing behavior.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 8M × 16 with quad-bank architecture for internal row access/precharge hiding.
  • Performance Clock frequency up to 143 MHz for the -7 speed grade with access time of 5.4 ns (CAS latency = 3).
  • Programmable Timing & Burst Programmable CAS latency (2 or 3 clocks) and selectable burst lengths (1, 2, 4, 8, full page) with sequential or interleaved burst sequences.
  • Interface Parallel memory interface with LVTTL I/O signaling; all signals referenced to the positive clock edge for fully synchronous operation.
  • Refresh & Power Modes Auto Refresh and Self Refresh supported with 4096 refresh cycles every 64 ms; includes power-saving power-down mode.
  • Power Operates from 3.0 V to 3.6 V supply (VDD/VDDQ nominal 3.3 V as specified in device overview).
  • Package & Temperature 54-ball TF-BGA package (54-TFBGA, 8 × 8) and specified operating temperature range 0°C to 70°C (TA).

Typical Applications

  • 3.3 V Synchronous Memory Systems Acts as main DRAM in system memory designs that require a parallel SDRAM interface and synchronous clocked operation.
  • Embedded Platforms Provides burst read/write capability and programmable latency for embedded systems that need predictable memory timing.
  • High-Speed Data Buffers Suitable for designs that require pipeline architecture and quad-bank access to support sustained data transfer operations.

Unique Advantages

  • Selectable CAS Latency: Programmable CAS = 2 or 3 clocks enables trade-offs between throughput and latency to match system timing requirements.
  • Flexible Burst Control: Burst lengths from 1 to full page and sequential/interleaved modes simplify burst-oriented transfers and memory controller integration.
  • Quad-Bank Architecture: Internal bank structure helps hide row access/precharge time and supports efficient multi-access patterns.
  • Synchronous Pipeline Design: All inputs and outputs are referenced to the positive clock edge, enabling consistent timing and easier system synchronization.
  • Wide Supply Range: 3.0 V–3.6 V supply support with nominal 3.3 V operation accommodates typical 3.3 V memory system rails.
  • Compact TF-BGA Package: 54-ball TF-BGA (8 × 8) package saves board area while providing the required ballout for parallel SDRAM integration.

Why Choose IS42S16800E-7BL?

The IS42S16800E-7BL combines a 128 Mbit SDRAM density with a fully synchronous, quad-bank pipeline architecture and programmable timing features to deliver predictable, low-latency parallel memory performance in 3.3 V systems. Its selectable CAS latency, flexible burst modes and built-in refresh capabilities make it appropriate for designs that require controlled timing and sustained data throughput.

This device is suited for engineers and procurement teams specifying parallel SDRAM in space-constrained board designs that require a 54-ball TF-BGA package and operation across the 0°C to 70°C commercial temperature range. Its feature set supports scalable integration into systems that rely on synchronous memory timing and burst-oriented transfers.

Request a quote or submit an inquiry for pricing and availability of IS42S16800E-7BL to get detailed lead time and ordering information.

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