IS42S32400D-7B

IC DRAM 128MBIT PAR 90TFBGA
Part Description

IC DRAM 128MBIT PAR 90TFBGA

Quantity 1,963 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S32400D-7B – IC DRAM 128MBIT PAR 90TFBGA

The IS42S32400D-7B is a 128 Mbit volatile DRAM device implemented as SDRAM with a parallel memory interface. It is organized as 4M × 32, supports a clock frequency up to 143 MHz and an access time of 5.4 ns, and is supplied in a 90‑TFBGA (8 × 13) package.

This device is intended for systems that require a 128 Mbit parallel SDRAM solution operating from a 3.0 V to 3.6 V supply and within an ambient temperature range of 0°C to 70°C.

Key Features

  • Memory Architecture — 128 Mbit DRAM organized as 4M × 32 to support a 32‑bit parallel data path.
  • SDRAM Technology — Synchronous DRAM with a parallel memory interface designed for synchronous operation.
  • Performance — Specified clock frequency of 143 MHz and an access time of 5.4 ns for timing-sensitive memory subsystems.
  • Supply Voltage — Operates from 3.0 V to 3.6 V.
  • Package — 90‑TFBGA (8 × 13) BGA package for compact board-level integration.
  • Operating Temperature — Rated for ambient operation from 0°C to 70°C (TA).

Typical Applications

  • System Memory — Provides 128 Mbit parallel SDRAM capacity for systems requiring a 32‑bit wide memory interface and defined timing characteristics.
  • Embedded Platforms — Suited for embedded designs that require a compact 90‑TFBGA SDRAM package and standard 3.0–3.6 V supply operation.
  • Consumer Electronics — Applicable to devices operating within 0°C–70°C where a 128 Mbit SDRAM with 5.4 ns access time is required.

Unique Advantages

  • 32‑Bit Data Organization: The 4M × 32 arrangement provides a full 32‑bit parallel data path for wider data transfer per cycle.
  • Defined Timing Performance: 143 MHz clock frequency and 5.4 ns access time provide clear timing parameters for system integration and memory timing budgets.
  • Standard Voltage Compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V system rails.
  • Space‑Efficient Package: 90‑TFBGA (8 × 13) package reduces board area while offering a BGA mounting option.
  • Specified Operating Range: Rated for ambient temperatures from 0°C to 70°C for temperature-controlled environments.
  • Backed by ISSI: Manufactured by Integrated Silicon Solution Inc (ISSI), providing traceable supplier information for procurement and sourcing.

Why Choose IC DRAM 128MBIT PAR 90TFBGA?

The IS42S32400D-7B delivers a clear, specification-driven 128 Mbit parallel SDRAM option with a 4M × 32 organization, defined clock and access time parameters, and a compact 90‑TFBGA package. These characteristics make it suitable for designs that require a 32‑bit parallel memory solution with known timing, voltage, and temperature requirements.

This device is well suited to engineers and procurement teams seeking a standardized 3.0–3.6 V SDRAM module from Integrated Silicon Solution Inc. Its documented performance and package details support straightforward integration into memory subsystems where these specific electrical and mechanical parameters are required.

Request a quote or submit an inquiry for the IS42S32400D-7B to receive pricing and availability information.

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