IS42S32400J-7BLI-TR

IC DRAM 128MBIT PAR 90TFBGA
Part Description

IC DRAM 128MBIT PAR 90TFBGA

Quantity 409 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization4M x 32
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS42S32400J-7BLI-TR – IC DRAM 128MBIT PAR 90TFBGA

The IS42S32400J-7BLI-TR is a 128‑Mbit SDRAM device configured as 4M × 32, supplied by Integrated Silicon Solution Inc (ISSI). It delivers synchronous DRAM storage with a 143 MHz clock specification and an access time of 5.4 ns.

Designed for systems that require parallel SDRAM memory in a compact 90‑TFBGA (8×13) package, the device supports LVTTL signaling and operates from 3.0 V to 3.6 V with an ambient temperature range of −40 °C to 85 °C.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 4M × 32 for parallel memory architectures.
  • Performance 143 MHz clock frequency and 5.4 ns access time to support synchronous data transfers.
  • Interface LVTTL memory interface for compatibility with 3.3 V logic domains.
  • Power Operates from 3.0 V to 3.6 V to match common 3.3 V system power rails.
  • Package 90‑TFBGA package (8×13) providing a compact footprint for board-level integration.
  • Operating Temperature Specified for −40 °C to 85 °C ambient operation.

Typical Applications

  • Embedded memory subsystems — Provides 128‑Mbit SDRAM storage for systems requiring synchronous parallel DRAM.
  • Buffering and working memory — Suited for applications needing low-latency access (5.4 ns) and a 143 MHz clocking domain.
  • 3.3 V logic systems — LVTTL interface and 3.0–3.6 V supply compatibility make it suitable for designs using 3.3 V signaling.
  • Temperature‑sensitive deployments — Rated for −40 °C to 85 °C for use in environments within this ambient range.

Unique Advantages

  • Compact BGA footprint: The 90‑TFBGA (8×13) package reduces board area for space‑constrained designs.
  • Synchronous DRAM performance: 143 MHz clocking and 5.4 ns access time provide deterministic synchronous memory timing.
  • 3.0–3.6 V supply range: Compatible with common 3.3 V power rails for straightforward integration.
  • LVTTL interface: Direct LVTTL signaling support simplifies interface design with 3.3 V logic.
  • Industrial temperature range: −40 °C to 85 °C rating supports operation across a wide ambient temperature window.
  • Manufacturer assurance: Produced by ISSI (Integrated Silicon Solution Inc), a known memory device supplier.

Why Choose IS42S32400J-7BLI-TR?

The IS42S32400J-7BLI-TR positions itself as a compact, synchronous DRAM option for designs requiring 128 Mbit of parallel SDRAM with LVTTL interfacing and 3.3 V-compatible power. Its combination of a 143 MHz clock rating, 5.4 ns access time, and a 90‑TFBGA package make it suitable for systems that balance performance and board‑area constraints.

This device is appropriate for engineers specifying a reliable SDRAM memory component from ISSI for embedded applications operating within the specified voltage and temperature ranges.

Request a quote or contact sales to inquire about availability, pricing, and lead times for the IS42S32400J-7BLI-TR.

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