IS43R16320F-6BLI

IC DRAM 512MBIT PAR 60TFBGA
Part Description

IC DRAM 512MBIT PAR 60TFBGA

Quantity 526 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R16320F-6BLI - 512Mbit DDR SDRAM in Compact TFBGA Package

The IS43R16320F-6BLI from ISSI is a 512Mbit synchronous dynamic RAM utilizing DDR (Double Data Rate) technology. Organized as 32M x 16, this volatile memory IC delivers 166MHz clock frequency operation with 7ns access time in a space-efficient 60-pin TFBGA package. Designed for embedded systems requiring reliable memory performance across industrial temperature ranges, this DRAM component provides cost-effective storage for applications demanding moderate density and proven DDR architecture.

Key Features

  • Memory Architecture: 512Mbit capacity organized as 32M x 16, providing flexible data width for parallel interface designs that need word-oriented access patterns.
  • DDR SDRAM Technology: Double data rate operation at 166MHz clock frequency enables efficient data throughput with 7ns access time and 15ns write cycle time.
  • Power Supply: Operates on 2.3V to 2.7V supply voltage, compatible with standard low-voltage digital systems and reducing overall power consumption.
  • Industrial Temperature Range: Qualified for -40°C to 85°C ambient temperature operation, ensuring reliable performance in harsh environmental conditions.
  • Compact Package: 60-pin TFBGA (8mm x 13mm) footprint minimizes board space requirements while maintaining standard parallel interface connectivity.

Typical Applications

  • Industrial Control Systems: This DDR SDRAM serves as main memory in programmable logic controllers and industrial computers where the extended temperature range ensures operation in factory floor environments and the parallel interface simplifies integration with existing controller architectures.
  • Embedded Computing Platforms: The 512Mbit density and DDR performance support single-board computers and embedded processors requiring moderate memory capacity with predictable latency characteristics for real-time operating systems.
  • Telecommunications Equipment: Network routers and switching equipment benefit from the reliable DDR architecture for packet buffering and routing table storage, while the industrial temperature rating supports deployment in equipment closets and outdoor installations.
  • Instrumentation and Test Equipment: Measurement systems and data acquisition devices utilize this DRAM for waveform storage and signal processing buffers where the parallel interface provides deterministic access patterns.
  • Automotive Infotainment: The -40°C to 85°C temperature range makes this memory suitable for non-safety automotive applications including dashboard displays and entertainment systems that require volatile storage for application data.

Unique Advantages

  • Proven DDR Architecture: Mature SDRAM technology reduces design risk and simplifies firmware development with well-understood timing characteristics and broad ecosystem support.
  • Cost-Effective Density: 512Mbit capacity hits the sweet spot for embedded applications that need more than 256Mbit but don't require gigabit-class memory, optimizing bill-of-materials costs.
  • Industrial Temperature Qualification: Extended -40°C to 85°C operating range eliminates the need for thermal management in many industrial enclosures and outdoor installations.
  • Space-Efficient Footprint: The compact 8mm x 13mm TFBGA package reduces PCB area requirements compared to TSOP alternatives while maintaining parallel interface simplicity.
  • Standard Parallel Interface: Direct processor bus connection without complex controllers simplifies hardware design and firmware initialization for legacy system compatibility.
  • Wide Supply Voltage Tolerance: 2.3V to 2.7V operating range provides margin for supply voltage variations and simplifies power distribution design in multi-voltage systems.

Why Choose IS43R16320F-6BLI?

The IS43R16320F-6BLI addresses the memory requirements of embedded and industrial systems that prioritize proven technology, cost efficiency, and environmental reliability over cutting-edge density. Its DDR SDRAM architecture provides a balance between performance and design simplicity, while the industrial temperature rating and compact TFBGA package support deployment in space-constrained and environmentally challenging applications. For engineers maintaining existing designs or developing new products based on established architectures, this component offers long-term availability and predictable performance characteristics.

This memory IC is particularly well-suited for mid-volume production where component cost, supply chain stability, and ease of integration are primary concerns, and where the 512Mbit density aligns with application memory budgets without over-provisioning capacity.

Get Started with IS43R16320F-6BLI

Our technical team can assist with integration guidance, pricing for your production volumes, and lead time information. Contact us to discuss your memory requirements and receive a detailed quotation for the IS43R16320F-6BLI.

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