IS43R16320F-6BL-TR
| Part Description |
IC DRAM 512MBIT PAR 60TFBGA |
|---|---|
| Quantity | 1,575 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 60-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS43R16320F-6BL-TR - 512Mbit DDR SDRAM Memory IC
The IS43R16320F-6BL-TR is a 512Mbit DDR SDRAM memory device configured as 32M x 16, providing fast and reliable volatile memory storage for embedded systems and digital applications. Operating at 166MHz with 7ns access time, this parallel interface DRAM delivers efficient data throughput in a compact 60-pin TFBGA package. Designed for commercial temperature ranges, it serves as a dependable memory solution for consumer electronics, networking equipment, and computing platforms.
Key Features
- High-Density Memory: 512Mbit capacity organized as 32M x 16 provides ample storage for application data, frame buffers, and system operations while maintaining a small physical footprint.
- DDR SDRAM Technology: Double data rate architecture enables data transfer on both rising and falling clock edges, maximizing bandwidth efficiency at 166MHz clock frequency with only 7ns access time.
- Power Supply: Operates on a standard 2.3V to 2.7V supply voltage, compatible with common embedded system power rails and contributing to overall system power efficiency.
- Parallel Interface: Direct parallel data bus connection simplifies integration with processors and controllers that support standard DDR SDRAM interfaces without requiring complex protocol conversion.
- Compact Package: 60-pin TFBGA package measuring 8mm x 13mm enables high-density PCB layouts and reduces board space requirements in space-constrained designs.
- Commercial Temperature Range: Qualified for 0°C to 70°C operation ensures reliable performance in standard indoor environments and commercial equipment applications.
Typical Applications
- Consumer Electronics: This SDRAM provides main memory or frame buffer storage for digital set-top boxes, media players, and home entertainment devices where moderate capacity and standard operating temperatures are sufficient.
- Networking Equipment: Serves as buffer memory in routers, switches, and network processors where 166MHz DDR performance supports packet processing and data forwarding operations in commercial-grade infrastructure.
- Embedded Computing: Functions as system memory in single-board computers, industrial controllers, and embedded modules that require volatile memory with parallel interface compatibility and commercial temperature tolerance.
- Display Systems: Acts as frame buffer memory in digital signage, point-of-sale terminals, and information displays where the 512Mbit capacity accommodates high-resolution graphics and video content.
- Telecommunications: Provides working memory for voice-over-IP systems, communication gateways, and telephony equipment operating in controlled indoor environments.
Unique Advantages
- Proven DDR Technology: Leverages mature DDR SDRAM architecture with broad software and hardware ecosystem support, reducing development time and compatibility concerns.
- Standard JEDEC Compliance: Adheres to industry-standard DDR specifications, ensuring interoperability with common memory controllers and simplifying design validation.
- Efficient Footprint: The TFBGA package delivers high density per square millimeter of board space, allowing designers to allocate more PCB area for functionality rather than memory.
- Simplified Power Management: Single supply voltage operation reduces BOM costs by eliminating the need for multiple voltage regulators or level shifters in many designs.
- Fast Write Cycles: 15ns write cycle time enables rapid data storage, supporting applications with frequent memory updates or burst write requirements.
- Established Supply Chain: Active lifecycle status and commercial-grade qualification provide design longevity assurance for products with multi-year production horizons.
Why Choose the IS43R16320F-6BL-TR?
The IS43R16320F-6BL-TR delivers a balance of capacity, performance, and physical size that suits commercial embedded applications requiring standard DDR memory. Its 166MHz operation and 7ns access time provide adequate bandwidth for typical embedded processors, while the 60-pin TFBGA package keeps board space requirements minimal. The device's commercial temperature rating and standard voltage requirements align well with cost-sensitive designs in controlled environments.
For engineering teams developing consumer electronics, networking gear, or embedded systems that operate indoors, this memory IC offers straightforward integration with widely supported DDR interfaces and toolchains. The active lifecycle status supports ongoing production planning, while the established DDR SDRAM technology reduces technical risk in both hardware and firmware development.
Get Started with IS43R16320F-6BL-TR
To request pricing, check stock availability, or discuss volume requirements for the IS43R16320F-6BL-TR, contact our sales team. We can assist with technical specifications, design-in support, and logistics planning for your memory requirements.