IS43R16320F-6TL

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 87 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency167 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R16320F-6TL - 512Mbit DDR SDRAM

The IS43R16320F-6TL is a 512-megabit Double Data Rate (DDR) Synchronous Dynamic Random Access Memory (SDRAM) designed for high-performance computing and embedded applications. With a 32M x 16 memory organization and 167 MHz clock frequency, this device delivers efficient data throughput for applications requiring substantial memory bandwidth. Operating at 2.3V to 2.7V, it provides a reliable memory solution for commercial-grade designs where cost-effective volatile memory is essential.

Key Features

  • Memory Architecture - 512 Mbit (32M x 16) DDR SDRAM configuration provides balanced density and I/O width for diverse embedded applications requiring moderate capacity with efficient parallel access.
  • High-Speed Operation - 167 MHz clock frequency with 7 ns access time and 15 ns write cycle time enables responsive data transfers suitable for real-time processing and buffering tasks.
  • Power Efficiency - 2.3V to 2.7V operating voltage range supports low-power system designs while maintaining compatibility with common logic voltage levels.
  • Standard DDR Interface - Parallel DDR SDRAM interface simplifies integration with controllers and processors that feature native DDR memory support.
  • Commercial Temperature Range - 0°C to 70°C operating temperature suits office, retail, and controlled-environment industrial applications.
  • Compact Package - 66-pin TSOP II (10.16mm width) footprint balances pin count with PCB space efficiency for space-conscious designs.

Typical Applications

  • Consumer Electronics - This DDR SDRAM serves as main memory or frame buffer in set-top boxes, digital TVs, and home networking equipment, where the 512 Mbit capacity and moderate speed meet multimedia processing needs without exceeding power budgets.
  • Embedded Computing - Industrial controllers, point-of-sale terminals, and embedded PCs leverage this memory for program execution and data buffering, benefiting from the standard DDR interface that simplifies board design and reduces development time.
  • Networking Equipment - Routers, switches, and access points use this SDRAM for packet buffering and routing table storage, where the parallel interface and 167 MHz operation support line-rate forwarding in moderate-throughput network segments.
  • Office Equipment - Printers, copiers, and multifunction devices employ this memory for document buffering and image processing, taking advantage of the commercial temperature rating that aligns with typical office environments.
  • Test and Measurement - Data acquisition systems and instrumentation utilize this DDR SDRAM for waveform capture and signal processing tasks where the 32M x 16 organization provides adequate depth for transient recording.

Unique Advantages

  • Proven DDR Technology: Well-established DDR SDRAM architecture reduces integration risk and benefits from widespread controller support across processor families.
  • Balanced Performance and Cost: 167 MHz operation delivers adequate bandwidth for commercial applications while maintaining cost-effectiveness compared to higher-speed memory alternatives.
  • Voltage Flexibility: 2.3V to 2.7V range accommodates both 2.5V nominal and 3.3V I/O systems, simplifying voltage regulator design in mixed-signal environments.
  • Standard Footprint: TSOP II packaging ensures compatibility with established PCB layouts and assembly processes, avoiding the need for design changes when migrating from similar DDR devices.
  • Simplified Sourcing: Commercial temperature and voltage grades align with high-volume consumer and industrial markets, supporting availability and competitive pricing.
  • Clear Thermal Limits: Defined 0°C to 70°C operating range enables straightforward thermal design without ambiguity about environmental constraints.

Why Choose the IS43R16320F-6TL?

The IS43R16320F-6TL is positioned for designs requiring reliable, cost-effective DDR SDRAM with mainstream performance characteristics. Its 512 Mbit density suits applications where memory needs exceed smaller devices but do not justify the cost and complexity of multi-gigabit solutions. The standard DDR interface and TSOP II package facilitate integration into established architectures, reducing time-to-market for product updates and platform extensions.

For system architects prioritizing predictable performance, broad controller compatibility, and straightforward supply chain management, this device offers a dependable memory foundation. Its commercial temperature rating and voltage range address the majority of office, consumer, and controlled-environment industrial use cases without premium pricing associated with extended specifications.

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