IS43R16320F-6TL
| Part Description |
IC DRAM 512MBIT PAR 66TSOP II |
|---|---|
| Quantity | 87 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 167 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS43R16320F-6TL - 512Mbit DDR SDRAM
The IS43R16320F-6TL is a 512-megabit Double Data Rate (DDR) Synchronous Dynamic Random Access Memory (SDRAM) designed for high-performance computing and embedded applications. With a 32M x 16 memory organization and 167 MHz clock frequency, this device delivers efficient data throughput for applications requiring substantial memory bandwidth. Operating at 2.3V to 2.7V, it provides a reliable memory solution for commercial-grade designs where cost-effective volatile memory is essential.
Key Features
- Memory Architecture - 512 Mbit (32M x 16) DDR SDRAM configuration provides balanced density and I/O width for diverse embedded applications requiring moderate capacity with efficient parallel access.
- High-Speed Operation - 167 MHz clock frequency with 7 ns access time and 15 ns write cycle time enables responsive data transfers suitable for real-time processing and buffering tasks.
- Power Efficiency - 2.3V to 2.7V operating voltage range supports low-power system designs while maintaining compatibility with common logic voltage levels.
- Standard DDR Interface - Parallel DDR SDRAM interface simplifies integration with controllers and processors that feature native DDR memory support.
- Commercial Temperature Range - 0°C to 70°C operating temperature suits office, retail, and controlled-environment industrial applications.
- Compact Package - 66-pin TSOP II (10.16mm width) footprint balances pin count with PCB space efficiency for space-conscious designs.
Typical Applications
- Consumer Electronics - This DDR SDRAM serves as main memory or frame buffer in set-top boxes, digital TVs, and home networking equipment, where the 512 Mbit capacity and moderate speed meet multimedia processing needs without exceeding power budgets.
- Embedded Computing - Industrial controllers, point-of-sale terminals, and embedded PCs leverage this memory for program execution and data buffering, benefiting from the standard DDR interface that simplifies board design and reduces development time.
- Networking Equipment - Routers, switches, and access points use this SDRAM for packet buffering and routing table storage, where the parallel interface and 167 MHz operation support line-rate forwarding in moderate-throughput network segments.
- Office Equipment - Printers, copiers, and multifunction devices employ this memory for document buffering and image processing, taking advantage of the commercial temperature rating that aligns with typical office environments.
- Test and Measurement - Data acquisition systems and instrumentation utilize this DDR SDRAM for waveform capture and signal processing tasks where the 32M x 16 organization provides adequate depth for transient recording.
Unique Advantages
- Proven DDR Technology: Well-established DDR SDRAM architecture reduces integration risk and benefits from widespread controller support across processor families.
- Balanced Performance and Cost: 167 MHz operation delivers adequate bandwidth for commercial applications while maintaining cost-effectiveness compared to higher-speed memory alternatives.
- Voltage Flexibility: 2.3V to 2.7V range accommodates both 2.5V nominal and 3.3V I/O systems, simplifying voltage regulator design in mixed-signal environments.
- Standard Footprint: TSOP II packaging ensures compatibility with established PCB layouts and assembly processes, avoiding the need for design changes when migrating from similar DDR devices.
- Simplified Sourcing: Commercial temperature and voltage grades align with high-volume consumer and industrial markets, supporting availability and competitive pricing.
- Clear Thermal Limits: Defined 0°C to 70°C operating range enables straightforward thermal design without ambiguity about environmental constraints.
Why Choose the IS43R16320F-6TL?
The IS43R16320F-6TL is positioned for designs requiring reliable, cost-effective DDR SDRAM with mainstream performance characteristics. Its 512 Mbit density suits applications where memory needs exceed smaller devices but do not justify the cost and complexity of multi-gigabit solutions. The standard DDR interface and TSOP II package facilitate integration into established architectures, reducing time-to-market for product updates and platform extensions.
For system architects prioritizing predictable performance, broad controller compatibility, and straightforward supply chain management, this device offers a dependable memory foundation. Its commercial temperature rating and voltage range address the majority of office, consumer, and controlled-environment industrial use cases without premium pricing associated with extended specifications.
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