KGD-2Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V

The KGD-2Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V from ESMT is a memory component offered as a Known Good Die within the ESMT SPI NAND series. The part name indicates SLC configurations and internal ECC functionality; specification fields list the device as a non-volatile memory with a 2G × 8 organization and a parallel memory interface.

This component is presented with manufacturer-level details including technology and supply characteristics and is RoHS compliant. The supplied specifications include MemoryFormat (DRAM) and Technology (DDR SDRAM) as recorded in the product data.

Key Features

• Memory Type Specified as Non-Volatile memory in the product data.
• Memory Format & Technology MemoryFormat is listed as DRAM and Technology is listed as DDR SDRAM in the specifications.
• Memory Organization Documented organization of 2G × 8 for capacity and bus-width planning.
• Memory Interface Parallel memory interface as stated in the specifications.
• Voltage Supply VoltageSupply is specified as 2.5V; the part name also references 1.8V/3V in its identifier.
• Internal ECC Internal ECC is indicated in the product name, denoting on-die error correction functionality.
• Known Good Die (KGD) Grade is listed as Known Good Die for die-level procurement and integration.
• RoHS Compliance RoHS Status is listed as Compliant in the product data.
• Manufacturer and Series Manufactured by ESMT and listed under the ESMT SPI NAND Known Good Die series.

Unique Advantages

• Internal ECC included: Internal ECC is part of the product name, indicating integrated error correction capability.
• Documented memory organization: The 2G × 8 organization is explicitly specified for capacity planning.
• Multiple voltage references provided: The product data includes a 2.5V supply value and a part-name reference to 1.8V/3V, allowing designers to reconcile supply requirements from provided documentation.
• Die-level supply option: Grade is Known Good Die, matching die-level procurement and assembly workflows.
• Standards-focused environmental status: RoHS compliance is specified in the product data.

Why Choose KGD-2Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V?

KGD-2Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V is positioned as a documented memory die offering with internal ECC, a 2G × 8 organization, and a parallel interface, provided by ESMT within their SPI NAND Known Good Die series. The product data captures key technical points—memory type, memory format/technology, interface, supply voltage entry, and compliance status—to help engineers evaluate fit for die-level integration.

This product is appropriate for designers and procurement teams who require clear, manufacturer-specified attributes such as Known Good Die grading and RoHS compliance. Use the documented specifications to match system power, interface, and organization needs during design and sourcing.

Request a quote or submit an inquiry to purchase KGD-2Gb-SLC(x1,-x2,-x4)-Internal-ECC,-1.8V/3V and include your required quantities and assembly details so we can provide pricing and availability information.