KGD-256Mbx16/-512Mbx8-DDR3-1.35V/1.5V

The KGD-256Mbx16/-512Mbx8-DDR3-1.35V/1.5V from ESMT is a DDR3 SDRAM Known Good Die intended for memory product integration. It is a volatile DRAM device offered in memory organizations of 256M × 16 and 512M × 8 with a parallel memory interface.

This component is positioned for use in designs and assemblies that require die-level DDR3 SDRAM and RoHS-compliant memory components, providing a straightforward memory building block for module and system integrators.

Key Features

• Memory Technology DDR3 SDRAM volatile memory format suitable for standard DRAM integration.
• Memory Organization Available as 256M × 16 or 512M × 8 to support different bus widths and capacity requirements.
• Memory Interface Parallel memory interface compatible with parallel DDR3 controller architectures.
• Voltage Supply Voltage supply specified as 2.5V in product specifications.
• Known Good Die (KGD) Supplied as Known Good Die for die-level assembly and integration workflows.
• Environmental Compliance RoHS compliant to meet common lead-free assembly requirements.
• Manufacturer and Series Manufactured by ESMT and offered as part of the ESMT DDR3 SDRAM KGD series.

Typical Applications

• Die-level memory integration — Use as a Known Good Die for multi-die assemblies, custom memory modules, or package-level integration.
• Memory module development — Appropriate for designers developing DDR3-based modules that require 256M×16 or 512M×8 organizations.
• Embedded system memory — Incorporated into embedded systems and boards that implement a parallel DDR3 interface and require RoHS-compliant DRAM.

Unique Advantages

• Die-level delivery: Supplied as Known Good Die to simplify integration into custom packages and multi-die solutions.
• Flexible organization options: Two memory organizations (256M×16 and 512M×8) to match different bus widths and capacity needs.
• Parallel DDR3 interface: Direct compatibility with parallel DDR3 controller designs for straightforward memory interfacing.
• RoHS compliant: Conforms to lead-free assembly requirements to support compliant manufacturing processes.
• ESMT-backed series: Part of the ESMT DDR3 SDRAM KGD series, aligning with a recognized memory product line.

Why Choose KGD-256Mbx16/-512Mbx8-DDR3-1.35V/1.5V?

This ESMT DDR3 SDRAM Known Good Die provides clear die-level memory options for teams building custom modules, multi-die packages, or embedded boards that require DDR3 memory organizations of 256M×16 or 512M×8. With a parallel interface and RoHS compliance, it serves as a practical choice for integration-focused memory designs.

Choose this part when you need a DDR3 SDRAM die from a known series and supplier, with the die-level form factor and organization options to support scalable memory assembly and production workflows.

Request a quote or submit an inquiry for pricing and availability to begin integrating KGD-256Mbx16/-512Mbx8-DDR3-1.35V/1.5V into your designs.