KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V
| Part Description |
LPSDR SDRAM 1.8V/2.5V/3.3V |
|---|---|
| Quantity | 1,456 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | LPSDR SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Known Good Die | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 1 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.02 |
Overview of KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V – LPSDR SDRAM 1.8V/2.5V/3.3V
The KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V from ESMT is a volatile DRAM device based on LPSDR SDRAM technology and provided as Known Good Die. The device is organized as 2M × 32 with a parallel memory interface, offering a defined memory density and interface style for system integration.
Specified with a 2.5V supply in the product specifications and delivered as Known Good Die, this device is RoHS compliant and intended for designs that require verified die-level SDRAM in a parallel-memory architecture.
Key Features
- Memory Type: Volatile DRAM implemented using LPSDR SDRAM technology, suitable where transient data storage is required.
- Memory Organization: 2M × 32 configuration, providing a fixed, known memory density for predictable address mapping and resource planning.
- Interface: Parallel memory interface for systems designed around parallel DRAM connectivity and bus-based memory architectures.
- Voltage Supply: 2.5V supply listed in the product specifications.
- Grade: Known Good Die (KGD), indicating die-level screening for integration into multi-die or package-level assemblies.
- Environmental Compliance: RoHS compliant, meeting common lead-free environmental requirements.
- Manufacturer and Series: Produced by ESMT as part of the ESMT LPSDR SDRAM KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V series.
Unique Advantages
- Known Good Die grading: Delivered as KGD to support die-level assembly workflows and reduce downstream bad-die handling.
- Predictable memory density: 2M × 32 organization simplifies capacity planning and address allocation in designs.
- Parallel interface compatibility: Matches designs requiring parallel DRAM connectivity without implying additional interface requirements.
- RoHS compliant: Supports lead-free and environmental-conformance requirements for end products.
- Manufacturer-backed: ESMT series alignment provides consistency in sourcing within the ESMT LPSDR SDRAM family.
Why Choose KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V?
This ESMT LPSDR SDRAM Known Good Die is positioned for applications that require a verified die-level volatile memory solution with a 2M × 32 organization and a parallel interface. Its KGD grading and RoHS compliance make it a practical option for engineers and manufacturing workflows that need predictable die quality and environmental conformity.
Choose this part when your design or assembly process specifies LPSDR SDRAM technology, a parallel memory interface, and the documented supply voltage and grade align with your system requirements.
Request a quote or submit an inquiry to receive pricing and availability information for KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V and to discuss how this ESMT Known Good Die can integrate into your design and manufacturing flow.
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