KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V

SDRAM KGD
Part Description

LPSDR SDRAM 1.8V/2.5V/3.3V

Quantity 1,456 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPSDR SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.02

Overview of KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V – LPSDR SDRAM 1.8V/2.5V/3.3V

The KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V from ESMT is a volatile DRAM device based on LPSDR SDRAM technology and provided as Known Good Die. The device is organized as 2M × 32 with a parallel memory interface, offering a defined memory density and interface style for system integration.

Specified with a 2.5V supply in the product specifications and delivered as Known Good Die, this device is RoHS compliant and intended for designs that require verified die-level SDRAM in a parallel-memory architecture.

Key Features

  • Memory Type: Volatile DRAM implemented using LPSDR SDRAM technology, suitable where transient data storage is required.
  • Memory Organization: 2M × 32 configuration, providing a fixed, known memory density for predictable address mapping and resource planning.
  • Interface: Parallel memory interface for systems designed around parallel DRAM connectivity and bus-based memory architectures.
  • Voltage Supply: 2.5V supply listed in the product specifications.
  • Grade: Known Good Die (KGD), indicating die-level screening for integration into multi-die or package-level assemblies.
  • Environmental Compliance: RoHS compliant, meeting common lead-free environmental requirements.
  • Manufacturer and Series: Produced by ESMT as part of the ESMT LPSDR SDRAM KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V series.

Unique Advantages

  • Known Good Die grading: Delivered as KGD to support die-level assembly workflows and reduce downstream bad-die handling.
  • Predictable memory density: 2M × 32 organization simplifies capacity planning and address allocation in designs.
  • Parallel interface compatibility: Matches designs requiring parallel DRAM connectivity without implying additional interface requirements.
  • RoHS compliant: Supports lead-free and environmental-conformance requirements for end products.
  • Manufacturer-backed: ESMT series alignment provides consistency in sourcing within the ESMT LPSDR SDRAM family.

Why Choose KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V?

This ESMT LPSDR SDRAM Known Good Die is positioned for applications that require a verified die-level volatile memory solution with a 2M × 32 organization and a parallel interface. Its KGD grading and RoHS compliance make it a practical option for engineers and manufacturing workflows that need predictable die quality and environmental conformity.

Choose this part when your design or assembly process specifies LPSDR SDRAM technology, a parallel memory interface, and the documented supply voltage and grade align with your system requirements.

Request a quote or submit an inquiry to receive pricing and availability information for KGD-2Mbx32-LPSDR-SDRAM-1.8V/2.5V/3.3V and to discuss how this ESMT Known Good Die can integrate into your design and manufacturing flow.

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