KGD-256Mbx8-SLC-NAND-Flash,-x8,-1.8V/3.3V

NAND Flash KGD
Part Description

SLC NAND Flash, x8, 1.8V/3.3V

Quantity 876 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatNAND FlashTechnologySLC NAND Flash
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeNon-Volatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization256M x 8
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of KGD-256Mbx8-SLC-NAND-Flash,-x8,-1.8V/3.3V – SLC NAND Flash, x8, 1.8V/3.3V

The KGD-256Mbx8-SLC-NAND-Flash,-x8,-1.8V/3.3V is a Non-Volatile NAND Flash memory device implemented with SLC NAND technology and organized as 256M × 8. It features a parallel memory interface and is supplied as a Known Good Die.

Key product attributes provided in the specifications include the SLC NAND architecture, 256M × 8 memory organization, a parallel interface and a listed supply voltage of 2.5V. The device is RoHS compliant.

Key Features

  • Memory Type & Technology  Non-Volatile memory implemented using SLC NAND Flash technology as specified for this product.
  • Memory Organization  256M × 8 organization providing an 8-bit (x8) memory arrangement.
  • Interface  Parallel memory interface suitable for systems designed to use parallel NAND Flash.
  • Voltage Supply  Specified supply voltage of 2.5V according to the product specifications.
  • Grade  Known Good Die (KGD) grade, supplied as die for die-level integration workflows.
  • Environmental Compliance  RoHS compliant as indicated in the product data.

Typical Applications

  • Embedded Systems  Non-volatile NAND storage for embedded-system designs requiring a 256M × 8 SLC NAND die with a parallel interface.
  • Board- and Module-Level Memory  Integration into boards or memory modules where a defined SLC NAND die organization and parallel access are required.
  • Die-Level Integration  Use in custom packaging or module assembly workflows that take advantage of Known Good Die supply.

Unique Advantages

  • SLC NAND Technology  Provides the SLC NAND architecture specified for stable single-level cell memory implementation.
  • Defined 256M × 8 Organization  Clear memory organization for designs that require an 8-bit wide NAND arrangement.
  • Parallel Interface  Parallel access simplifies integration into systems designed for parallel NAND Flash connectivity.
  • Known Good Die Supply  KGD grade supports die-level workflows and integration into custom assemblies or modules.
  • RoHS Compliant  Meets RoHS requirements as indicated in the product information.

Why Choose KGD-256Mbx8-SLC-NAND-Flash,-x8,-1.8V/3.3V?

The KGD-256Mbx8-SLC-NAND-Flash,-x8,-1.8V/3.3V pairs SLC NAND architecture with a 256M × 8 organization and a parallel interface, supplied in Known Good Die form and compliant with RoHS. Its specified supply voltage of 2.5V and die-grade delivery make it appropriate for designs and manufacturing flows that require die-level NAND Flash integration.

This product is positioned for engineers and procurement teams specifying SLC NAND die for integration into modules, boards, or custom assemblies where the listed characteristics—memory organization, interface type, grade and compliance—match project requirements.

Request a quote or submit a sales inquiry to receive pricing, availability and lead-time information for KGD-256Mbx8-SLC-NAND-Flash,-x8,-1.8V/3.3V.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1998


    Headquarters: Hsinchu Science Park, Hsinchu, Taiwan


    Employees: 400+


    Revenue: $377.8 Million


    Certifications and Memberships: N/A


    Featured Products
    Latest News
    keyboard_arrow_up