KGD-64Mbx16/-128Mbx8-DDR3-1.35V/1.5V

The KGD-64Mbx16/-128Mbx8-DDR3-1.35V/1.5V from ESMT is a DDR3 SDRAM Known Good Die (KGD) solution provided at die level for integration into memory assemblies and system designs. It implements DDR3 SDRAM architecture with memory organizations of 64M × 16 and 128M × 8 and presents a parallel memory interface for board- or module-level integration.

This ESMT KGD product is RoHS compliant and supplied as volatile DRAM suitable for designs that require die-level DDR3 memory building blocks and known-good-die quality for assembly and manufacturing workflows.

Key Features

• Memory Technology  DDR3 SDRAM technology provided as volatile DRAM for standard DDR3 memory architecture.
• Memory Organization  Available as 64M × 16 or 128M × 8 organizations, enabling flexibility in density and bus-width choices at die level.
• Memory Interface  Parallel memory interface suitable for integration into module or board assemblies that use parallel DDR3 signaling.
• Voltage Supply  Specification lists a 2.5V supply. (Product name indicates 1.35V/1.5V.)
• Grade  Known Good Die (KGD) grade, supplied as dies validated for assembly and further packaging or integration.
• Environmental Compliance  RoHS compliant to support environmentally regulated product builds.
• Manufacturer  Produced by ESMT and offered within the ESMT DDR3 SDRAM KGD series.

Typical Applications

• Memory module assembly  Die-level DDR3 SDRAM for OEM and third-party memory module packaging and assembly workflows.
• Board-level integration  Integration into PCBs and systems that require DDR3 die components and parallel memory interfaces.
• Embedded systems  Use as onboard DDR3 memory building blocks where die-level parts are incorporated into embedded designs or custom packages.

Unique Advantages

• Die-level flexibility:  Offered as Known Good Die to support custom packaging, module assembly, and high-yield manufacturing flows.
• Multiple memory organizations:  Choice of 64M × 16 and 128M × 8 organizations allows designers to match density and bus width to system requirements.
• DDR3 architecture:  Provides DDR3 SDRAM technology at die level for designs targeting DDR3 memory architectures.
• Parallel interface:  Parallel memory interface simplifies integration into systems and modules designed for DDR3 signaling.
• Regulatory compliance:  RoHS compliance helps meet environmental requirements for regulated markets.
• Manufacturer provenance:  Supplied by ESMT as part of their DDR3 SDRAM KGD series.

Why Choose KGD-64Mbx16/-128Mbx8-DDR3-1.35V/1.5V?

This ESMT DDR3 KGD provides a focused solution for designers and manufacturers who need die-level DDR3 memory building blocks with selectable memory organizations and known-good-die grading for reliable assembly. Its combination of DDR3 SDRAM architecture, parallel interface, and KGD quality supports integration into module assembly and board-level systems where die-level memory components are required.

The product is suited for procurement and engineering teams seeking RoHS-compliant DDR3 dies from a recognized memory supplier, enabling consistent manufacturing workflows and straightforward incorporation into custom memory solutions.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for KGD-64Mbx16/-128Mbx8-DDR3-1.35V/1.5V. Our team can assist with volume requirements and delivery timelines.