KGD-64Mbx32-LPDDR3-SDRAM-1.2V

The KGD-64Mbx32-LPDDR3-SDRAM-1.2V from ESMT is a volatile DRAM device in a Known Good Die (KGD) format, based on LPDDR3 SDRAM technology. It is organized as 64M × 32 with a parallel memory interface and is listed as RoHS compliant.

The part number and product name include "1.2V" while the provided specification lists a voltage supply of 2.5V. This product is presented as a die-level LPDDR3 memory option for designs that specify LPDDR3 SDRAM and KGD-grade components.

Key Features

• Memory Technology  LPDDR3 SDRAM; volatile DRAM core suitable for standard LPDDR3 die-level implementations.
• Memory Organization  64M × 32 organization providing a defined capacity and data width for system memory mapping.
• Interface  Parallel memory interface for integration with parallel LPDDR3 memory subsystems.
• Grade  Known Good Die (KGD) grade indicating die-level qualification for integration in multi-die or wafer-level assemblies.
• Voltage  Voltage supply value listed as 2.5V in the specifications; product name includes 1.2V.
• Compliance  RoHS compliant to meet environmental regulatory requirements.
• Manufacturer & Series  Produced by ESMT as part of the ESMT LPDDR3 SDRAM KGD series.

Typical Applications

• Die-level memory integration  Used where Known Good Die LPDDR3 memory is required for assembly into multi-die modules or custom packages.
• Embedded LPDDR3 systems  Suitable for designs that incorporate LPDDR3 SDRAM technology and require a defined 64M × 32 memory organization.
• Board-level memory arrays  Can be used as a component in board-level memory subsystems that accept parallel LPDDR3 die.

Unique Advantages

• KGD form factor: Known Good Die grading provides die-level qualification useful for wafer- or module-level assembly workflows.
• Defined memory organization: 64M × 32 configuration gives predictable capacity and data width for memory mapping and system design.
• LPDDR3 technology: Aligns with LPDDR3-based system architectures where LPDDR3 SDRAM is specified.
• Parallel interface: Parallel memory interface supports integration into parallel LPDDR3 memory architectures.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements in product designs.
• ESMT series consistency: Part of the ESMT LPDDR3 SDRAM KGD series for consistent sourcing within the same technology family.

Why Choose KGD-64Mbx32-LPDDR3-SDRAM-1.2V?

KGD-64Mbx32-LPDDR3-SDRAM-1.2V positions itself as a die-level LPDDR3 SDRAM option that combines a clear 64M × 32 organization, parallel interface, Known Good Die grading and RoHS compliance. These attributes make it suitable for designs that require LPDDR3 die integration and traceable component specification from ESMT.

Choose this part when your design requires LPDDR3 SDRAM in a KGD format with a defined organization and regulatory compliance. The component is presented for engineers and procurement teams seeking a die-level LPDDR3 memory option within the ESMT LPDDR3 SDRAM series.

Request a quote or submit an inquiry for KGD-64Mbx32-LPDDR3-SDRAM-1.2V to obtain pricing, availability, and evaluation options.