KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V

LPDDR2 SDRAM KGD
Part Description

LPDDR2 SDRAM 1.2/1.8V

Quantity 824 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatDRAMTechnologyLPDDR2 SDRAM
Memory SizeN/AAccess TimeN/AGradeKnown Good Die
Clock FrequencyN/AVoltage2.5VMemory TypeVolatile
Operating TemperatureN/AWrite Cycle Time Word PageN/APackagingN/A
Mounting MethodN/AMemory InterfaceParallelMemory Organization64M x 16
Moisture Sensitivity Level1RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.32

Overview of KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V – LPDDR2 SDRAM 1.2/1.8V

The KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V from ESMT is a volatile DRAM device implemented in LPDDR2 SDRAM technology and supplied in a Known Good Die (KGD) grade. The device is organized as 64M × 16 with a parallel memory interface and a specified supply voltage of 2.5V.

This die-level LPDDR2 offering is intended for integration into designs that require raw DRAM die form factor and predictable memory organization, while meeting RoHS environmental requirements.

Key Features

  • Memory Type & Technology Volatile DRAM implemented as LPDDR2 SDRAM, providing the defined behavior of DRAM in die form.
  • Memory Organization 64M × 16 organization for clear capacity and data-width planning in system designs.
  • Interface Parallel memory interface suitable for designs that integrate parallel DRAM dies.
  • Voltage Supply Specified supply voltage: 2.5V.
  • Grade Known Good Die (KGD), supplied as validated die for wafer-level or die-level assembly workflows.
  • Environmental Compliance RoHS compliant for environmentally regulated manufacturing environments.

Typical Applications

  • Die-level memory integration Designed for use in wafer-level or die-level assembly where a validated DRAM die is required.
  • Multi-chip modules and system-in-package designs Can be incorporated into MCM or SiP assemblies as a discrete LPDDR2 die with a 64M × 16 organization.
  • OEM memory subsystems Suited for OEM workflows that assemble custom memory modules or packages from known-good dies.

Unique Advantages

  • Known Good Die format: Delivered as KGD to support wafer-level and die-level assembly with reduced risk of die failures during integration.
  • Clear memory organization: The 64M × 16 configuration provides a straightforward capacity and interface width for system planning.
  • Parallel interface: A parallel DRAM interface that aligns with designs expecting parallel memory connectivity.
  • Defined supply requirement: A specified 2.5V supply simplifies power-rail planning in system design.
  • RoHS compliant: Meets environmental compliance requirements for regulated manufacturing.

Why Choose KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V?

The KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V from ESMT positions itself as a die-level LPDDR2 SDRAM option for engineers and manufacturers who need a validated DRAM die with a defined organization and interface. Its Known Good Die grade and RoHS compliance support assembly workflows that require die-level reliability and regulatory conformity.

This part is suitable for designs and production environments that integrate raw DRAM dies into custom modules, multi-chip packages, or other die-level assemblies where clear capacity, interface type, and supply voltage are important for system planning.

To request a quote or submit a purchase inquiry for KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V, please provide your requirements and quantity details to initiate pricing and availability information.

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