KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V
| Part Description |
LPDDR2 SDRAM 1.2/1.8V |
|---|---|
| Quantity | 824 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | N/A | Memory Format | DRAM | Technology | LPDDR2 SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Known Good Die | ||
| Clock Frequency | N/A | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | N/A | Write Cycle Time Word Page | N/A | Packaging | N/A | ||
| Mounting Method | N/A | Memory Interface | Parallel | Memory Organization | 64M x 16 | ||
| Moisture Sensitivity Level | 1 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.32 |
Overview of KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V – LPDDR2 SDRAM 1.2/1.8V
The KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V from ESMT is a volatile DRAM device implemented in LPDDR2 SDRAM technology and supplied in a Known Good Die (KGD) grade. The device is organized as 64M × 16 with a parallel memory interface and a specified supply voltage of 2.5V.
This die-level LPDDR2 offering is intended for integration into designs that require raw DRAM die form factor and predictable memory organization, while meeting RoHS environmental requirements.
Key Features
- Memory Type & Technology Volatile DRAM implemented as LPDDR2 SDRAM, providing the defined behavior of DRAM in die form.
- Memory Organization 64M × 16 organization for clear capacity and data-width planning in system designs.
- Interface Parallel memory interface suitable for designs that integrate parallel DRAM dies.
- Voltage Supply Specified supply voltage: 2.5V.
- Grade Known Good Die (KGD), supplied as validated die for wafer-level or die-level assembly workflows.
- Environmental Compliance RoHS compliant for environmentally regulated manufacturing environments.
Typical Applications
- Die-level memory integration Designed for use in wafer-level or die-level assembly where a validated DRAM die is required.
- Multi-chip modules and system-in-package designs Can be incorporated into MCM or SiP assemblies as a discrete LPDDR2 die with a 64M × 16 organization.
- OEM memory subsystems Suited for OEM workflows that assemble custom memory modules or packages from known-good dies.
Unique Advantages
- Known Good Die format: Delivered as KGD to support wafer-level and die-level assembly with reduced risk of die failures during integration.
- Clear memory organization: The 64M × 16 configuration provides a straightforward capacity and interface width for system planning.
- Parallel interface: A parallel DRAM interface that aligns with designs expecting parallel memory connectivity.
- Defined supply requirement: A specified 2.5V supply simplifies power-rail planning in system design.
- RoHS compliant: Meets environmental compliance requirements for regulated manufacturing.
Why Choose KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V?
The KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V from ESMT positions itself as a die-level LPDDR2 SDRAM option for engineers and manufacturers who need a validated DRAM die with a defined organization and interface. Its Known Good Die grade and RoHS compliance support assembly workflows that require die-level reliability and regulatory conformity.
This part is suitable for designs and production environments that integrate raw DRAM dies into custom modules, multi-chip packages, or other die-level assemblies where clear capacity, interface type, and supply voltage are important for system planning.
To request a quote or submit a purchase inquiry for KGD-64Mbx16-LPDDR2-SDRAM-1.2/1.8V, please provide your requirements and quantity details to initiate pricing and availability information.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
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